Inventor
YING-JU CHEN
Inventor
TW
Overview
Patents· 45 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices34%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1034%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
H10DInorganic electric semiconductor devices5%
G02BOptical elements, systems or apparatus2%
H01GCapacitors2%
C07KPeptides2%
C12NMicroorganisms or enzymes2%
B23KSoldering or unsoldering1%
C12YEnzymes1%
PatentTitleYear
12,500,127Method of fabricating semiconductor structure202512,368,115Supporting InFO packages to reduce warpage202512,362,178Method for fabricating a chip package202512,331,091Chimeric signal peptides for protein production202512,334,459Integrated circuits202512,327,819Devices employing thermal and mechanical enhanced layers and methods of forming same202512,288,802Structure and method for forming integrated high density MIM capacitor202512,266,637Die stack structure and manufacturing method thereof202512,249,580Passivation scheme design for wafer singulation202512,218,097Bonding to alignment marks with dummy alignment marks202512,211,707Integrated circuit package and method of forming thereof202512,211,823Semiconductor package with shared barrier layer in redistribution and via and method of manufacturing the same202512,176,248Wafer level dicing method and semiconductor device202412,176,270Package structure with photonic die and method202412,119,338Semiconductor device packages, packaging methods, and packaged semiconductor devices202412,068,241Semiconductor structure202412,050,216Method of detecting antibodies against JEV or ZIKV using recombinant baculoviruses expressing prM/e202412,009,386Structure and method for forming integrated high density MIM capacitor202412,009,335Structure and method of forming a joint assembly202411,942,436Passivation scheme design for wafer singulation202411,908,692Method for fabricating a chip package202411,862,590Integrated circuit package and method of forming thereof202411,862,599Bonding to alignment marks with dummy alignment marks202411,848,271Redistribution layer structures for integrated circuit package202311,817,445Semiconductor device packages, packaging methods, and packaged semiconductor devices202311,791,246Package structure with photonic die and method202311,764,165Supporting InFO packages to reduce warpage202311,735,487Semiconductor structure and method of fabricating the same202311,735,555Manufacturing method of semiconductor structure202311,715,755Structure and method for forming integrated high density MIM capacitor202311,705,343Integrated circuit package and method of forming thereof202311,699,663Passivation scheme design for wafer singulation202311,495,559Integrated circuits202211,469,218Devices employing thermal and mechanical enhanced layers and methods of forming same202211,362,066Semiconductor structure and manufacturing method thereof202211,362,064Semiconductor package with shared barrier layer in redistribution and via202211,355,468Structure and method of forming a joint assembly202211,315,855Package structure with photonic die and method202211,309,291Die stack structure and manufacturing method thereof202211,270,989Semiconductor device packages, packaging methods, and packaged semiconductor devices202211,257,775Mechanisms for forming post-passivation interconnect structure202211,195,804Semiconductor structure202111,183,475Semiconductor structure202111,177,201Semiconductor packages including routing dies and methods of forming same202111,164,857Semiconductor device packages, packaging methods, and packaged semiconductor devices2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (43)· patent assignee history
2021–2025Based in TW· patent location history
2024Patents assigned to UNIV CHUNG YUAN CHRISTIAN (1)· patent assignee history
2025Patents assigned to TAIWAN BIO MFG CORPORATION (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 43 | 2021–2025 |
| TAIWAN BIO MFG CORPORATION | 1 | 2025 |
| UNIV CHUNG YUAN CHRISTIAN | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 45 | 2021–2025 |