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Inventor

Weineng Jiang

Inventor
Shenzhen, CN

Overview

2→
Patents
2015–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics25%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts25%
G06FElectric digital data processing25%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes25%
PatentTitleYear
10,942,949Data processing method and apparatus for virtual resource20219,156,198'Temperature controlled molding of composite components'2015

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2015Patents assigned to FLEXTRONICS AP LLC (1)· patent assignee history
2015Patents assigned to HILL CHARLES R (1)· patent assignee history
2015Patents assigned to JIANG WEINENG (1)· patent assignee history
2015Patents assigned to LALICAN MARLON M (1)· patent assignee history
2015Patents assigned to MICHONSKI RICHARD DALE (1)· patent assignee history
2015Based in Doumen, CN· patent location history
2021Based in Shenzhen, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FLEXTRONICS AP LLC12015
HILL CHARLES R12015
JIANG WEINENGself12015
LALICAN MARLON M12015
MICHONSKI RICHARD DALE12015
Locations
LocationPatentsSpan
Shenzhen, CN12021
Doumen, CN12015