Inventor
Henry Xu
Inventor
Shanghai, CN
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1064%
H01LSemiconductor devices36%
PatentTitleYear
9,837,340Apparatus, system, and method for wireless connection in integrated circuit packages20179,385,094'Apparatus, system, and method for wireless connection in integrated circuit packages'20168,981,573'Apparatus, system, and method for wireless connection in integrated circuit packages'20158,963,333'Apparatus, system, and method for wireless connection in integrated circuit packages'20158,513,108'Apparatus, system, and method for wireless connection in integrated circuit packages'20138,084,867'Apparatus, system, and method for wireless connection in integrated circuit packages'20117,981,726'Copper plating connection for multi-die stack in substrate package'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2017Patents assigned to INTEL CORP (7)· patent assignee history
2011–2013Patents assigned to SAKAMOTO SHINICHI (2)· patent assignee history
2011–2013Patents assigned to TANG JIAMIAO (2)· patent assignee history
2011–2013Patents assigned to XU HENRY (2)· patent assignee history
2011–2015Based in Shanghai, CN· patent location history
2016–2017Based in Pudong, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 7 | 2011–2017 |
| SAKAMOTO SHINICHI | 2 | 2011–2013 |
| TANG JIAMIAO | 2 | 2011–2013 |
| XU HENRYself | 2 | 2011–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shanghai, CN | 5 | 2011–2015 |
| Pudong, CN | 2 | 2016–2017 |