Inventor
MASAYUKI AOIKE
Inventor
JP
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H01LSemiconductor devices24%
H10DInorganic electric semiconductor devices13%
H03FAmplifiers11%
H04BTransmission11%
H05KPrinted circuits4%
H01QAntennas, i.e. radio aerials2%
H03HImpedance networks, e.g. resonant circuits2%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h102%
PatentTitleYear
12,537,549Radio frequency module and communication device202612,469,824Integrated circuit and radio-frequency module202512,334,884Power amplification device and an RF circuit module202512,278,425Radio-frequency module and communication apparatus202512,262,556Power amplifier202512,199,083RF circuit module and manufacturing method therefor202512,136,664Semiconductor device and method for producing the same202412,009,359Semiconductor device202411,876,032Semiconductor device202411,804,450Semiconductor device and semiconductor module202311,776,865Semiconductor device and method for manufacturing semiconductor device202311,764,197RF circuit module and manufacturing method therefor202311,677,018Semiconductor device and method for producing the same202311,145,607Semiconductor chip2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to MURATA MANUFACTURING CO (14)· patent assignee history
2021–2026Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MURATA MANUFACTURING CO | 14 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 14 | 2021–2026 |