Inventor
Hideto Yamaguchi
Inventor
Toyama, JP
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
C23CCoating metallic material12%
G01KMeasuring temperature12%
H01LSemiconductor devices12%
H01GCapacitors9%
LOC107%
G05DSystems for controlling or regulating non-electric variables5%
B23KSoldering or unsoldering2%
C30BSingle-crystal growth2%
F27DDetails or accessories of furnaces, kilns, ovens or retorts, in so far as they are of kinds occurring in more than one kind of furnace2%
PatentTitleYear
10,684,174Substrate processing apparatus, and thermocouple202010,475,652Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium201910,418,293Substrate processing apparatus, method of manufacturing semiconductor device, and thermocouple support201910,228,291Substrate processing apparatus, and thermocouple2019D0790490'Reaction tube'2017D0786951'Reaction tube'2017D0780606'Protector tube for thermocouple'2017D0778741'Protector tube for thermocouple'2017D0778742'Protector tube for thermocouple'20179,418,881'Substrate processing apparatus capable of switching control mode of heater'20169,269,638'Temperature detecting apparatus, substrate processing apparatus and method of manufacturing semiconductor device'20168,822,240'Temperature detecting apparatus, substrate processing apparatus and method of manufacturing semiconductor device'20148,380,360'Temperature control method, method of obtaining a temperature correction value, method of manufacturing a semiconductor device and substrate treatment apparatus'20138,266,095'Substrate processing system and operation inspecting method'20127,394,649'Solid electrolytic capacitor with an improved mounting property, and manufacturing method of the same'20087,342,772'Solid electrolytic capacitor'20087,277,271'Solid electrolytic capacitor'20077,059,908'Electrical connector having a shield'20066,746,908'Temperature controlling method, thermal treating apparatus, and method of manufacturing semiconductor device'20046,711,531'Temperature control simulation method and apparatus'20046,671,509'Mobile communication unit and mobile communication system'20036,496,749'Semiconductor producing apparatus and temperature control method therefor'20025,390,074'Chip-type solid electrolytic capacitor and method of manufacturing the same'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–2008Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (4)· patent assignee history
2002–2004Patents assigned to KOKUSAI ELECTRIC CO LTD (3)· patent assignee history
2002–2006Based in Tokyo, JP· patent location history
2003Based in Unazuki, JP· patent location history
2004–2020Patents assigned to HITACHI INT ELECTRIC INC (15)· patent assignee history
2007–2008Based in Kyoto, JP· patent location history
2012–2016Patents assigned to YAMAGUCHI HIDETO (4)· patent assignee history
2012–2013Based in Imizu-shi, JP· patent location history
2014–2020Based in Toyama, JP· patent location history
2019–2020Patents assigned to KOKUSAI ELECTRIC CORP (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI INT ELECTRIC INC | 15 | 2004–2020 |
| KOKUSAI ELECTRIC CORP | 4 | 2019–2020 |
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 4 | 1995–2008 |
| YAMAGUCHI HIDETOself | 4 | 2012–2016 |
| KOKUSAI ELECTRIC CO LTD | 3 | 2002–2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| Toyama, JP | 12 | 2014–2020 |
| Tokyo, JP | 4 | 2002–2006 |
| Kyoto, JP | 3 | 2007–2008 |
| Imizu-shi, JP | 2 | 2012–2013 |
| Unazuki, JP | 1 | 2003 |