Inventor
Yoshihisa Kagawa
Inventor
Kanagawa, JP
Overview
Patents· 32 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation15%
H04NPictorial communication, e.g. television13%
H10DInorganic electric semiconductor devices7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
H10NElectric solid-state devices not otherwise provided for4%
H10BElectronic memory devices3%
C23CCoating metallic material2%
H01JElectric discharge tubes or discharge lamps2%
PatentTitleYear
11,107,855Method for bonding and connecting substrates202111,004,879Semiconductor device, solid-state image pickup element, imaging device, and electronic apparatus202110,985,102Semiconductor device, fabrication method for a semiconductor device and electronic apparatus202110,930,845Memory device and method of manufacturing the same202110,837,448Counter-rotating axial flow fan202010,804,313Semiconductor device and solid-state imaging device202010,707,258Semiconductor device with multiple substrates electrically connected through an insulating film202010,665,623Semiconductor device, solid-state image pickup element, imaging device, and electronic apparatus202010,431,621Semiconductor device, fabrication method for a semiconductor device and electronic apparatus201910,347,832Memory device and method of manufacturing the same201910,236,238Semiconductor device201910,134,795Semiconductor device with multiple substrates electrically connected through an insulating film and manufacturing method201810,038,024Semiconductor device, fabrication method for a semiconductor device and electronic apparatus201810,026,769Semiconductor device and solid-state imaging device20189,911,778'Semiconductor device, fabrication method for a semiconductor device and electronic apparatus'20189,799,587'Semiconductor device'20179,748,478'Memory device and method of manufacturing the same'20179,720,405'Antenna inspection system, antenna inspection apparatus and antenna inspection method'20179,666,627'Electronic apparatus and manufacturing method for an electronic apparatus having multiple substrates directly electrically connected through an insulating film'20179,443,802'Semiconductor device, fabrication method for a semiconductor device and electronic apparatus'20169,379,006'Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus'20169,373,785'Memory device and method of manufacturing the same'20169,190,275'Bonding substrates with electrical connection through insulating film'20159,111,763'Semiconductor device, fabrication method for a semiconductor device and electronic apparatus'20158,896,125'Semiconductor device, fabrication method for a semiconductor device and electronic apparatus'20148,685,786'Method of manufacturing a semiconductor memory device having a resistance change memory layer'20148,664,763'Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus'20147,845,180'Automatic icemaker'20107,662,728'Substrate processing method'20107,601,402'Method for forming insulation film and apparatus for forming insulation film'20097,602,061'Semiconductor device and method for manufacturing semiconductor device'20097,037,092'Roller pump with housing having integrated reduction gear housing'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2010Patents assigned to JAPAN SERVO (2)· patent assignee history
2009–2021Patents assigned to SONY CORP (24)· patent assignee history
2009–2021Based in Kanagawa, JP· patent location history
2010–2020Based in Kiryu, JP· patent location history
2010Based in Yokohama, JP· patent location history
2014–2017Patents assigned to KAGAWA YOSHIHISA (5)· patent assignee history
2014–2017Patents assigned to FUJII NOBUTOSHI (2)· patent assignee history
2017–2021Patents assigned to SONY SEMICONDUCTOR SOLUTIONS CORP (3)· patent assignee history
2017Based in Tokyo, JP· patent location history
2019–2021Based in Nagasaki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SONY CORP | 24 | 2009–2021 |
| KAGAWA YOSHIHISAself | 5 | 2014–2017 |
| SONY SEMICONDUCTOR SOLUTIONS CORP | 3 | 2017–2021 |
| FUJII NOBUTOSHI | 2 | 2014–2017 |
| JAPAN SERVO | 2 | 2006–2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 24 | 2009–2021 |
| Nagasaki, JP | 2 | 2019–2021 |
| Kiryu, JP | 2 | 2010–2020 |
| Tokyo, JP | 1 | 2017 |
| Yokohama, JP | 1 | 2010 |