Inventor
Benson Chan
Inventor
Vestal, NY, US
Overview
Patents· 51 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits31%
H01RElectrically-conductive connections15%
G02BOptical elements, systems or apparatus13%
Y10TTechnical subjects covered by former us classification12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
G06KGraphical data reading4%
G01RMeasuring electric variables3%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes3%
B29CShaping or joining of plastics2%
B23KSoldering or unsoldering1%
PatentTitleYear
9,451,693'Electrically conductive adhesive (ECA) for multilayer device interconnects'20169,007,202'Human being tracking and monitoring system'20158,502,082'Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same'20138,196,281'Method of applying force to electrical contacts on a printed circuit board'20128,069,012'Sampling sufficiency testing'20118,028,390'Spring actuated clamping mechanism'20117,972,178'High density connector for interconnecting fine pitch circuit packaging structures'20117,841,741'LED lighting assembly and lamp utilizing same'20107,738,249'Circuitized substrate with internal cooling structure and electrical assembly utilizing same'20107,713,767'Method of making circuitized substrate with internal optical pathway using photolithography'20107,679,005'Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same'20107,552,091'Method and system for tracking goods'20097,541,058'Method of making circuitized substrate with internal optical pathway'20097,501,839'Interposer and test assembly for testing electronic devices'20097,441,709'Electronic card assembly'20087,252,515'Non-oriented wire in elastomer electrical contact'20077,204,697'Non-oriented wire in elastomer electrical contact'20077,152,319'Method of making high speed circuit board'20067,142,121'Radio frequency device for tracking goods'20067,108,809'Optical coupler replication arrangement and process'20066,995,322'High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same'20066,981,880'Non-oriented wire in elastomer electrical contact'20066,974,915'Printed wiring board interposer sub-assembly and method'20056,964,884'Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same'20056,892,451'Method of making an interposer sub-assembly in a printed wiring board'20056,848,914'Electrical coupling of substrates by conductive buttons'20056,828,514'High speed circuit board and method for fabrication'20046,822,875'Assembly of opto-electronic module with improved heat sink'20046,741,778'Optical device with chip level precision alignment'20046,712,527'Fiber optic connections and method for using same'20046,679,707'Land grid array connector and method for forming the same'20046,676,301'Enhanced optical coupler'20046,652,159'Enhanced optical transceiver arrangement'20036,644,864'Stacked optical coupler'20036,635,866'Multi-functional fiber optic coupler'20036,547,452'Alignment systems for subassemblies of overmolded optoelectronic modules'20036,545,226'Printed wiring board interposer sub-assembly'20036,527,457'Optical fiber guide module and a method for making the same'20036,516,129'Processing protective plug insert for optical modules'20036,508,595'Assembly of opto-electronic module with improved heat sink'20036,386,890'Printed circuit board to module mounting and interconnecting structure and method'20026,349,032'Electronic chip packaging'20026,224,396'Compliant, surface-mountable interposer'20016,015,301'Surface mount socket'20005,879,168'Single C-beam contact'19995,793,618'Module mounting assembly'19985,785,535'Computer system with surface mount socket'19985,764,071'Method and system for testing an electronic module mounted on a printed circuit board'19985,730,620'Method and apparatus for locating electrical circuit members'19985,530,291'Electronic package assembly and connector for use therewith'19965,468,996'Electronic package assembly and connector for use therewith'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–2007Patents assigned to IBM (30)· patent assignee history
1995–2016Based in Vestal, NY, US· patent location history
2004–2015Patents assigned to ENDICOTT INTERCONNECT TECH INC (18)· patent assignee history
2011–2016Patents assigned to CHAN BENSON (4)· patent assignee history
2011Patents assigned to BANK OF AMERICA (1)· patent assignee history
2011Based in Mooresville, NC, US· patent location history
2013–2016Patents assigned to LAUFFER JOHN M (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 30 | 1995–2007 |
| ENDICOTT INTERCONNECT TECH INC | 18 | 2004–2015 |
| CHAN BENSONself | 4 | 2011–2016 |
| LAUFFER JOHN M | 2 | 2013–2016 |
| BANK OF AMERICA | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Vestal, New York, US | 50 | 1995–2016 |
| Mooresville, NC, US | 1 | 2011 |