Inventor
Ferenc M. Bozso
Inventor
Ridgefield, CT, US
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
G02BOptical elements, systems or apparatus17%
H10DInorganic electric semiconductor devices12%
G06FElectric digital data processing10%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light10%
H05KPrinted circuits10%
G11CStatic stores7%
H04LTransmission of digital information, e.g. telegraphic communication7%
H04QSelecting2%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation2%
PatentTitleYear
7,724,759'Method for the asynchronous arbitration of a high frequency bus in a long latency environment'20107,659,535'High speed data channel including a CMOS VCSEL driver and a high performance photodetector and CMOS photoreceiver'20107,551,453'Optically connectable circuit board with optical component(s) mounted thereon'20097,548,431'Optically connectable circuit board with optical component(s) mounted thereon'20097,539,376'Optically connectable circuit board with optical component(s) mounted thereon'20097,496,122'High speed data channel including a CMOS VCSEL driver and a high performance photodetector and CMOS photoreceiver'20097,492,800'High speed data channel including a CMOS VCSEL driver and a high performance photodetector and CMOS photoreceiver'20097,339,963'High speed data channel including a CMOS VCSEL driver and a high performance photodetector and CMOS photoreceiver'20087,211,816'Method for in-situ continuity check on an optical bus'20077,120,327'Backplane assembly with board to board optical interconnections'20067,095,620'Optically connectable circuit board with optical component(s) mounted thereon'20066,756,651'CMOS-compatible metal-semiconductor-metal photodetector'20046,515,515'Bidirectional data transfer path having increased bandwidth'20036,337,287'High speed, high bandwidth, high density nonvolatile memory system'20026,242,950'Bidirectional data transfer path having increased bandwidth'20016,067,245'High speed, high bandwidth, high density nonvolatile memory system'20006,040,203'Clock skew minimization and method for integrated circuits'20006,016,267'High speed, high bandwidth, high density, nonvolatile memory system'20006,014,036'Bidirectional data transfer path having increased bandwidth'20005,760,478'Clock skew minimization system and method for integrated circuits'19985,734,764'Method and apparatus for achieving a fully-connected nonblocking optical crossbar switch having wide transfer paths and minimal latency by exploiting the transparency of silicon at selected wavelengths'19985,692,121'Recovery unit for mirrored processors'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2010Patents assigned to IBM (22)· patent assignee history
1997–2000Based in Peekskill, NY, US· patent location history
2000–2010Based in Ridgefield, CT, US· patent location history
2000–2003Based in Fairfield, CT, US· patent location history
2009–2010Based in Ridgefeild, CT, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 22 | 1997–2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ridgefield, CT, US | 10 | 2000–2010 |
| Ridgefeild, CT, US | 5 | 2009–2010 |
| Peekskill, New York, US | 4 | 1997–2000 |
| Fairfield, CT, US | 3 | 2000–2003 |