Inventor
Jeffrey Drue David
Inventor
San Jose, CA, US
Overview
Patents· 99 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%
B24DTools for grinding, buffing or sharpening8%
H01LSemiconductor devices8%
G05BControl or regulating systems in general6%
G01BMeasuring length, thickness or similar linear dimensions5%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light2%
G16ZInformation and communication technology [ict] specially adapted for specific application fields, not otherwise provided for2%
G06NComputing arrangements based on specific computational models2%
PatentTitleYear
11,029,673Generating robust machine learning predictions for semiconductor manufacturing processes202111,022,642Semiconductor yield prediction202110,948,900Display of spectra contour plots versus time for semiconductor processing system control202110,777,470Selective inclusion/exclusion of semiconductor chips in accelerated failure tests202010,766,119Spectra based endpointing for chemical mechanical polishing202010,734,293Process control techniques for semiconductor manufacturing processes202010,651,098Polishing with measurement prior to deposition of outer layer202010,430,719Process control techniques for semiconductor manufacturing processes201910,276,460Endpointing detection for chemical mechanical polishing based on spectrometry201910,086,492Applying dimensional reduction to spectral data from polishing substrates201810,012,494Grouping spectral data from polishing substrates20189,886,026'Endpoint method using peak location of spectra contour plots versus time'20189,833,874Applying dimensional reduction to spectral data from polishing substrates20179,811,077'Polishing with pre deposition spectrum'20179,649,743'Dynamically tracking spectrum features for endpoint detection'20179,583,405'Endpointing detection for chemical mechanical polishing based on spectrometry'20179,573,242'Computer program product and method of controlling polishing of a substrate'20179,551,567'Reducing noise in spectral data from polishing substrates'20179,482,610'Techniques for matching spectra'20169,372,116'Automatic initiation of reference spectra library generation for optical monitoring'20169,362,186'Polishing with eddy current feed meaurement prior to deposition of conductive layer'20169,352,440'Serial feature tracking for endpoint detection'20169,346,146'Adjusting polishing rates by using spectrographic monitoring of a substrate during processing'20169,289,875'Feed forward and feed-back techniques for in-situ process control'20169,283,653'Dynamically tracking spectrum features for endpoint detection'20169,233,450'Optical detection of metal layer clearance'20169,227,293'Multi-platen multi-head polishing architecture'20169,221,147'Endpointing with selective spectral monitoring'20159,168,630'User-input functions for data sequences in polishing endpoint detection'20159,142,466'Using spectra to determine polishing endpoints'20159,117,751'Endpointing detection for chemical mechanical polishing based on spectrometry'20159,056,383'Path for probe of spectrographic metrology system'20159,011,202'Fitting of optical model with diffraction effects to measured spectrum'20158,992,286'Weighted regression of thickness maps from spectral data'20158,977,379'Endpoint method using peak location of spectra contour plots versus time'20158,954,186'Selecting reference libraries for monitoring of multiple zones on a substrate'20158,944,884'Fitting of optical model to measured spectrum'20158,942,842'Varying optical coefficients to generate spectra for polishing control'20158,932,107'Gathering spectra from multiple optical heads'20158,930,013'Adaptively tracking spectrum features for endpoint detection'20158,892,568'Building a library of spectra for optical monitoring'20148,874,250'Spectrographic monitoring of a substrate during processing using index values'20148,834,229'Dynamically tracking spectrum features for endpoint detection'20148,815,109'Spectra based endpointing for chemical mechanical polishing'20148,814,631'Tracking spectrum features in two dimensions for endpoint detection'20148,808,059'Spectraphic monitoring based on pre-screening of theoretical library'20148,755,928'Automatic selection of reference spectra library'20148,755,927'Feedback for polishing rate correction in chemical mechanical polishing'20148,751,033'Adaptive tracking spectrum features for endpoint detection'20148,747,189'Method of controlling polishing'20148,718,810'Semi-quantitative thickness determination'20148,679,979'Using optical metrology for within wafer feed forward process control'20148,666,665'Automatic initiation of reference spectra library generation for optical monitoring'20148,579,675'Methods of using optical metrology for feed back and feed forward process control'20138,569,174'Using spectra to determine polishing endpoints'20138,554,351'Spectrographic monitoring of a substrate during processing using index values'20138,547,538'Construction of reference spectra with variations in environmental effects'20138,535,115'Gathering spectra from multiple optical heads'20138,518,827'Spectrum based endpointing for chemical mechanical polishing'20138,467,896'Feedback for polishing rate correction in chemical mechanical polishing'20138,392,012'Multiple libraries for spectrographic monitoring of zones of a substrate during processing'20138,369,978'Adjusting polishing rates by using spectrographic monitoring of a substrate during processing'20138,352,061'Semi-quantitative thickness determination'20138,292,693'Using optical metrology for wafer to wafer feed back process control'20128,260,446'Spectrographic monitoring of a substrate during processing using index values'20128,202,738'Endpoint method using peak location of modified spectra'20128,190,285'Feedback for polishing rate correction in chemical mechanical polishing'20128,088,298'Spectra based endpointing for chemical mechanical polishing'20128,039,397'Using optical metrology for within wafer feed forward process control'20118,014,004'Determining physical property of substrate'20117,952,708'High throughput measurement system'20117,938,714'Polishing pad assembly with glass or crystalline window'20117,931,522'Removable optical monitoring system for chemical mechanical polishing'20117,840,375'Methods and apparatus for generating a library of spectra'20107,774,086'Substrate thickness measuring during polishing'20107,768,659'Determining copper concentration in spectra'20107,764,377'Spectrum based endpointing for chemical mechanical polishing'20107,746,485'Determining physical property of substrate'20107,657,342'Substrate thickness measuring during polishing'20107,651,385'Polishing system with optical head'20107,614,936'Spectrum based endpointing for chemical mechanical polishing'20097,614,933'Polishing pad assembly with glass or crystalline window'20097,444,198'Determining physical property of substrate'20087,409,260'Substrate thickness measuring during polishing'20087,406,394'Spectra based endpointing for chemical mechanical polishing'20087,306,507'Polishing pad assembly with glass or crystalline window'20077,226,337'Platen and head rotation rates for monitoring chemical mechanical polishing'20077,226,339'Spectrum based endpointing for chemical mechanical polishing'20077,210,980'Sealed polishing pad, system and methods'20077,163,437'System with sealed polishing pad'20077,153,185'Substrate edge detection'20067,112,119'Sealed polishing pad methods'20067,097,537'Determination of position of sensor measurements during polishing'20067,074,109'Chemical mechanical polishing control system and method'20067,025,658'Platen and head rotation rates for monitoring chemical mechanical polishing'20066,991,516'Chemical mechanical polishing with multi-stage monitoring of metal clearing'20066,945,845'Chemical mechanical polishing apparatus with non-conductive elements'20056,435,942'Chemical mechanical polishing processes and components'20026,361,405'Utility wafer for chemical mechanical polishing'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2021Patents assigned to APPLIED MATERIALS INC (93)· patent assignee history
2002Based in Sunnyvale, CA, US· patent location history
2005–2021Based in San Jose, CA, US· patent location history
2012–2016Patents assigned to DAVID JEFFREY DRUE (33)· patent assignee history
2012–2016Patents assigned to LEE HARRY Q (22)· patent assignee history
2012–2016Patents assigned to BENVEGNU DOMINIC J (20)· patent assignee history
2012–2015Patents assigned to SWEDEK BOGUSLAW A (19)· patent assignee history
2014Based in Santa Clara, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 93 | 2002–2021 |
| DAVID JEFFREY DRUEself | 33 | 2012–2016 |
| LEE HARRY Q | 22 | 2012–2016 |
| BENVEGNU DOMINIC J | 20 | 2012–2016 |
| SWEDEK BOGUSLAW A | 19 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 96 | 2005–2021 |
| Sunnyvale, California, US | 2 | 2002 |
| Santa Clara, California, US | 1 | 2014 |