LexDanaLexDanabeta
Inventor

BYEONGHOON KIM

Inventor
KR

Overview

3→
Patents
2022–2023
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices43%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H01JElectric discharge tubes or discharge lamps14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
PatentTitleYear
11,715,653Substrate processing apparatus202311,688,697Emi shielding for flip chip package with exposed die backside202311,355,452EMI shielding for flip chip package with exposed die backside2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2023Patents assigned to STATS CHIPPAC PTE LTD (2)· patent assignee history
2022–2023Based in KR· patent location history
2023Patents assigned to SAMSUNG ELECTRONICS CO LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
STATS CHIPPAC PTE LTD22022–2023
SAMSUNG ELECTRONICS CO LTD12023
Locations
LocationPatentsSpan
KR32022–2023