Inventor

Kensuke Sakai

Inventor

Tokyo, JP

Overview

2003–2018

Patent span

Performing operations

Primary field (CPC B)

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary

B23KSoldering or unsoldering35%

Y10TTechnical subjects covered by former us classification15%

F16BDevices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges10%

A61KPreparations for medical, dental or toiletry purposes5%

A61LMethods or apparatus for sterilising materials or objects in general5%

A61PSpecific therapeutic activity of chemical compounds or medicinal preparations5%

B29CShaping or joining of plastics5%

B29LIndexing scheme associated with subclass b29c, relating to particular articles5%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%

B62DMotor vehicles5%

PatentTitleYear

Assembled from patent assignee/location history and declaration credentials.

2003–2018Patents assigned to FUJI HEAVY IND LTD (8)· patent assignee history

2003–2018Based in Tokyo, JP· patent location history

2005Based in Aichi, JP· patent location history

2015Patents assigned to SAKAI KENSUKE (4)· patent assignee history

2015Patents assigned to KATAYAMA YOSHINORI (1)· patent assignee history

2015Patents assigned to KIMURA KEIGO (1)· patent assignee history

2015Based in Otsu, JP· patent location history

2018Patents assigned to SUBARU CORP (2)· patent assignee history

Assignee and location history derived from the patent record.

Assignees

Locations