Inventor
Hiroshi Funakura
Inventor
Kanagawa, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
7,148,529'Semiconductor package'20066,960,494'Semiconductor package and method of manufacturing the same'20056,836,012'Semiconductor package and method of manufacturing the same'20046,469,373'Semiconductor apparatus with improved thermal and mechanical characteristic under-fill layer and manufacturing method therefor'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2006Patents assigned to TOSHIBA KK (4)· patent assignee history
2002Based in Yokohama, JP· patent location history
2004–2006Based in Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOSHIBA KK | 4 | 2002–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 3 | 2004–2006 |
| Yokohama, JP | 1 | 2002 |