Inventor

Edward Dale DAVIS

Inventor

Overview

2→

Patents

2022–2023

Patent span

Performing operations

Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary

B29CShaping or joining of plastics29%

B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering29%

B22FWorking metallic powder14%

B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts14%

Y02PClimate change mitigation technologies in the production or processing of goods14%

PatentTitleYear

11,618,217Generating three-dimensional objects2023 11,254,068Three-dimensional (3D) printing method2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2023Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (2)· patent assignee history

2022Based in US· patent location history

2023Based in ES· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HEWLETT PACKARD DEVELOPMENT CO	2	2022–2023

Locations

Location	Patents	Span
ES	1	2023
US	1	2022