Inventor
Ya-yi CHENG
Inventor
TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices26%
H10DInorganic electric semiconductor devices26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
H10BElectronic memory devices3%
PatentTitleYear
12,538,776Methods for selectively removing material202612,482,705Conductive feature formation and structure using bottom-up filling deposition202512,417,945Contact features of semiconductor device and method of forming same202512,328,890Contact with a silicide region202512,308,292Methods of forming semiconductor device structures202512,272,600Contact features of semiconductor device and method of forming same202512,237,218Method of fabricating contact structure202511,532,503Conductive feature structure including a blocking region202211,411,094Contact with a silicide region2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (9)· patent assignee history
2022–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 9 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 9 | 2022–2026 |