Inventor

John D. Williams

Inventor
Decatur, AL, US

Overview

19→
Patents
2005–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 19 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Fprimary
H01FMagnets12%
H01QAntennas, i.e. radio aerials11%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering7%
H01PWaveguides7%
B29CShaping or joining of plastics5%
H03HImpedance networks, e.g. resonant circuits5%
H05KPrinted circuits5%
B22FWorking metallic powder4%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts4%
B29LIndexing scheme associated with subclass b29c, relating to particular articles4%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2005–2020Patents assigned to BOEING CO (18)· patent assignee history
2005Based in Colorado Springs, CO, US· patent location history
2017–2020Based in Decatur, AL, US· patent location history
2019Based in Chicago, IL, US· patent location history
2021Patents assigned to WILLIAMS JARVIS (1)· patent assignee history
2021Based in Middletown, RI, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
BOEING CO182005–2020
WILLIAMS JARVISself12021
Locations
LocationPatentsSpan
Decatur, AL, US162017–2020
Middletown, RI, US12021
Chicago, Illinois, US12019
Colorado Springs, CO, US12005