Inventor
CHENG-I HUANG
Inventor
TW
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices21%
H10DInorganic electric semiconductor devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
G06FElectric digital data processing10%
H03KPulse technique8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
G06TImage data processing or generation, in general5%
G06VImage or video recognition or understanding5%
H04NPictorial communication, e.g. television5%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
PatentTitleYear
12,417,332Integrated circuit, system for and method of forming an integrated circuit202512,211,793Standard-cell layout structure with horn power and smart metal cut202512,159,899Semiconductor device202412,125,839Semiconductor device and layout thereof202412,073,170Integrated circuit, system for and method of forming an integrated circuit202411,735,625Semiconductor device202311,727,544Constructing images of users' faces by stitching non-overlapping images202311,704,465Integrated circuit, system for and method of forming an integrated circuit202311,437,321Standard-cell layout structure with horn power and smart metal cut202211,294,286Pattern formation method using a photo mask for manufacturing a semiconductor device202211,228,709Constructing images of users' faces by stitching non-overlapping images2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (9)· patent assignee history
2022–2023Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (2)· patent assignee history
2022–2025Based in TW· patent location history
2022–2023Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 9 | 2022–2025 |
| HEWLETT PACKARD DEVELOPMENT CO | 2 | 2022–2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 9 | 2022–2025 |
| US | 2 | 2022–2023 |