Inventor
HUEI-WEN HSIEH
Inventor
TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices24%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
C23CCoating metallic material8%
H01JElectric discharge tubes or discharge lamps8%
H10DInorganic electric semiconductor devices8%
A61FFilters implantable into blood vessels5%
A61MDevices for introducing media into, or onto, the body5%
PatentTitleYear
12,575,344Interconnect structures and methods and apparatuses for forming the same202612,400,862Interconnect structures and methods and apparatuses for forming the same202512,354,910Bi-layer alloy liner for interconnect metallization and methods of forming the same202512,347,728Bi-layer alloy liner for interconnect metallization and methods of forming the same202512,094,770Ruthenium-based liner for a copper interconnect202412,080,594Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same202411,854,878Bi-layer alloy liner for interconnect metallization and methods of forming the same202311,694,899Interconnect structures and methods and apparatuses for forming the same202311,430,692Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (9)· patent assignee history
2022–2026Based in TW· patent location history
2023Patents assigned to TAIWAN SEMICONDUCTOR MFG LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 9 | 2022–2026 |
| TAIWAN SEMICONDUCTOR MFG LTD | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 9 | 2022–2026 |