Inventor
Hsin-Hsien Lu
Inventor
Hsinchu, TW
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
B24BMachines, devices, or processes for grinding or polishing24%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
C09GPolishing compositions4%
B08BCleaning in general2%
H01JElectric discharge tubes or discharge lamps2%
PatentTitleYear
10,770,314Semiconductor device, tool, and method of manufacturing202010,734,254Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method202010,504,753Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method201910,377,013Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system201910,325,772Apparatus and method for wafer cleaning20199,852,899Wafer back-side polishing system and method for integrated circuit device manufacturing processes20179,601,409'Protruding contact for integrated chip'20179,597,771'Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system'20179,576,789'Apparatus, method, and composition for far edge wafer cleaning'20179,559,021'Wafer back-side polishing system and method for integrated circuit device manufacturing processes'20179,466,501'Method and apparatus for improving CMP planarity'20169,434,047'Retainer ring'20169,415,479'Conductive chemical mechanical planarization polishing pad'20169,287,127'Wafer back-side polishing system and method for integrated circuit device manufacturing processes'20168,921,150'Process to achieve contact protrusion for single damascene via'20148,889,544'Dielectric protection layer as a chemical-mechanical polishing stop layer'20148,828,875'Method and apparatus for improving CMP planarity'20148,348,719'Polisher for chemical mechanical planarization'20138,252,682'Method for thinning a wafer'20128,021,566'Method for pre-conditioning CMP polishing pad'20117,105,446'Apparatus for pre-conditioning CMP polishing pad'20066,962,869'SiOCH low k surface protection layer formation by CxHy gas plasma treatment'20056,770,570'Method of forming a semiconductor device with a substantially uniform density low-k dielectric layer'20046,677,251'Method for forming a hydrophilic surface on low-k dielectric insulating layers for improved adhesion'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2014Patents assigned to TAIWAN SEMICONDUCTOR MFG (10)· patent assignee history
2004–2020Based in Hsinchu, TW· patent location history
2005–2011Based in Hsin Chu, TW· patent location history
2012–2014Patents assigned to LU HSIN-HSIEN (3)· patent assignee history
2012–2014Patents assigned to SHUE SHAU-LIN (3)· patent assignee history
2013–2014Patents assigned to BAO TIEN-I (2)· patent assignee history
2014Based in Hs, TW· patent location history
2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (14)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 14 | 2016–2020 |
| TAIWAN SEMICONDUCTOR MFG | 10 | 2004–2014 |
| LU HSIN-HSIENself | 3 | 2012–2014 |
| SHUE SHAU-LIN | 3 | 2012–2014 |
| BAO TIEN-I | 2 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 20 | 2004–2020 |
| Hsin Chu, TW | 3 | 2005–2011 |
| Hs, TW | 1 | 2014 |