Inventor
JAMES M. DERDERIAN
Inventor
US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
B23KSoldering or unsoldering8%
G01RMeasuring electric variables8%
G11CStatic stores8%
H05KPrinted circuits8%
PatentTitleYear
12,543,261Solder mask fault fiber optics sensor202611,967,576Systems for thermally treating conductive elements on semiconductor and wafer structures202411,776,877Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths202311,139,258Bonding pads with thermal pathways2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to MICRON TECHNOLOGY INC (4)· patent assignee history
2021–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 4 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 4 | 2021–2026 |