Inventor
Yubin LIN
Inventor
CN
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices29%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein14%
PatentTitleYear
12,443,069Display panel and display device202511,823,911Process of package-then-etch three-dimensional package structure electrically connected by plated copper pillars202311,217,459Package-before-etch three-dimensional package structure electrically connected by plated copper pillars and process thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2023Patents assigned to JIANGSU CHANGJIANG ELECTRONICS TECH CO LTD (2)· patent assignee history
2022–2025Based in CN· patent location history
2025Patents assigned to BEIJING BOE TECHNOLOGY DEV CO LTD (1)· patent assignee history
2025Patents assigned to BOE TECHNOLOGY GROUP CO LTD (1)· patent assignee history
2025Patents assigned to FUZHOU BOE OPTOELECTRONICS TECH CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| JIANGSU CHANGJIANG ELECTRONICS TECH CO LTD | 2 | 2022–2023 |
| BEIJING BOE TECHNOLOGY DEV CO LTD | 1 | 2025 |
| BOE TECHNOLOGY GROUP CO LTD | 1 | 2025 |
| FUZHOU BOE OPTOELECTRONICS TECH CO LTD | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 3 | 2022–2025 |