Inventor
Kyaw Oo Aung
Inventor
Singapore, SG
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1060%
H01LSemiconductor devices20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
PatentTitleYear
9,281,274'Integrated circuit through-substrate via system with a buffer layer and method of manufacture thereof'20167,443,039'System for different bond pads in an integrated circuit package'20087,005,370'Method of manufacturing different bond pads on the same substrate of an integrated circuit package'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2008Patents assigned to ST ASSEMBLY TEST SERVICES LTD (2)· patent assignee history
2006Based in Clementi, SG· patent location history
2008–2016Based in Singapore, SG· patent location history
2016Patents assigned to AUNG KYAW OO (1)· patent assignee history
2016Patents assigned to JI LING (1)· patent assignee history
2016Patents assigned to NA DUK JU (1)· patent assignee history
2016Patents assigned to STATS CHIPPAC LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ST ASSEMBLY TEST SERVICES LTD | 2 | 2006–2008 |
| AUNG KYAW OOself | 1 | 2016 |
| JI LING | 1 | 2016 |
| NA DUK JU | 1 | 2016 |
| STATS CHIPPAC LTD | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 2 | 2008–2016 |
| Clementi, SG | 1 | 2006 |