Inventor
Tadashi Takemoto
Inventor
Ibaraki, JP
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering39%
C22CAlloys35%
H05KPrinted circuits26%
PatentTitleYear
10,518,362Solder alloy, solder paste, and electronic circuit board201910,300,562Solder alloy, solder paste, and electronic circuit board201910,213,880Solder alloy, solder paste, and electronic circuit board20199,956,649Solder alloy, solder paste, and electronic circuit board20189,931,716Solder alloy, solder composition, solder paste, and electronic circuit board20189,445,508'Solder alloy, solder paste, and electronic circuit board'20169,221,132'Solder alloy, solder paste, and electronic circuit board'20159,221,129'Solder alloy, solder paste, and electronic circuit board'20155,173,126'Aluminum brazing paste'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992Patents assigned to NIPPON GENMA KK (1)· patent assignee history
1992Patents assigned to TOYO ALUMINIUM KK (1)· patent assignee history
1992Based in Toyonaka, JP· patent location history
2015–2019Patents assigned to HARIMA CHEMICALS INC (8)· patent assignee history
2015–2019Based in Ibaraki, JP· patent location history
2015Based in Tsukuba, JP· patent location history
2019Based in Hyogo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HARIMA CHEMICALS INC | 8 | 2015–2019 |
| NIPPON GENMA KK | 1 | 1992 |
| TOYO ALUMINIUM KK | 1 | 1992 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ibaraki, JP | 5 | 2015–2019 |
| Hyogo, JP | 2 | 2019 |
| Tsukuba, JP | 1 | 2015 |
| Toyonaka, JP | 1 | 1992 |