Inventor
Byeongchan KIM
Inventor
KR
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
H10BElectronic memory devices6%
PatentTitleYear
12,512,427Semiconductor device including lower pads having different widths and semiconductor package including the same202512,451,474Semiconductor package and method of manufacturing the same202512,199,056Semiconductor device, semiconductor package and method of manufacturing the same202512,119,306Semiconductor package202412,021,034Semiconductor package and method of manufacturing the semiconductor package202411,682,630Semiconductor package2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to SAMSUNG ELECTRONICS CO LTD (6)· patent assignee history
2023–2025Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 6 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 6 | 2023–2025 |