Inventor
Jack Liu
Inventor
Taipei, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H04BTransmission11%
H04LTransmission of digital information, e.g. telegraphic communication11%
H10DInorganic electric semiconductor devices11%
H04WWireless communication networks6%
LOC136%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use6%
PatentTitleYear
10,796,947Method of manufacturing a semiconductor device202010,700,207Semiconductor device integrating backside power grid and related integrated circuit and fabrication method202010,673,603Integrated circuit with radio frequency interconnect202010,510,776Semiconductor device with common active area and method for manufacturing the same2019D0862402Memory heat dissipation sink20199,887,863'Transceiver group and associated router'2018Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2018–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2018–2020Based in Taipei, TW· patent location history
2019Patents assigned to KINGSTON DIGITAL INC (1)· patent assignee history
2019Based in New Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2018–2020 |
| KINGSTON DIGITAL INC | 1 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 5 | 2018–2020 |
| New Taipei, TW | 1 | 2019 |