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Inventor

Scott Sperl

Inventor
Carefree, AZ, US

Overview

3→
Patents
2009–2012
Patent span
Chemistry
Primary field (CPC C)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

Y10Tprimary
Y10TTechnical subjects covered by former us classification27%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form18%
C23CCoating metallic material18%
C25DProcesses for the electrolytic or electrophoretic production of coatings18%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering9%
F16KValves9%
PatentTitleYear
8,118,989'Methods of bonding pure rhenium to a substrate'20127,998,594'Methods of bonding pure rhenium to a substrate'20117,509,738'Solid-free-form fabrication of hot gas valve discs'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2012Patents assigned to HONEYWELL INT INC (3)· patent assignee history
2009–2012Based in Carefree, AZ, US· patent location history
2012Patents assigned to MITTENDORF DON (1)· patent assignee history
2012Patents assigned to SPERL SCOTT (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HONEYWELL INT INC32009–2012
MITTENDORF DON12012
SPERL SCOTTself12012
Locations
LocationPatentsSpan
Carefree, AZ, US32009–2012