Inventor
Linda Mai BUI
Inventor
DE
Overview
Patents· 2 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Bprimary
G01BMeasuring length, thickness or similar linear dimensions25%
G01NInvestigating or analysing materials by determining their chemical or physical properties25%
G06NComputing arrangements based on specific computational models25%
G06TImage data processing or generation, in general25%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2023Patents assigned to SIEMENS AG (2)· patent assignee history
2022–2023Based in DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SIEMENS AG | 2 | 2022–2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| DE | 2 | 2022–2023 |