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Inventor

Mitsuaki Iwashita

Inventor
Nirasaki, JP

Overview

49→
Patents
1997–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 49 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
C23CCoating metallic material20%
H01LSemiconductor devices12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%
B05DProcesses for applying fluent materials to surfaces, in general4%
B08BCleaning in general3%
B24BMachines, devices, or processes for grinding or polishing3%
C25DProcesses for the electrolytic or electrophoretic production of coatings3%
F26BDrying solid materials or objects by removing liquid therefrom2%
PatentTitleYear
11,004,684Forming method of hard mask202110,224,208Plating method and recording medium201910,224,202Forming method of hard mask, forming apparatus of hard mask and recording medium201910,199,240Substrate processing method, substrate processing apparatus, and storage medium201910,138,556Plating method, plating apparatus, and storage medium201810,030,308Plating method, plating system and storage medium20189,966,306Catalyst layer forming method, catalyst layer forming system and recording medium20189,888,585'Method for manufacturing wiring structure, copper displacement plating solution, and wiring structure'20189,837,308Plating method, plating system and storage medium20179,777,379'Plating apparatus, plating method and storage medium'20179,731,322'Plating apparatus, plating method and storage medium having plating program stored thereon'20179,725,810'Plating method, plating apparatus and storage medium'20179,711,363'Plating method, recording medium and plating system'20179,650,717'Pre-treatment method of plating, storage medium, and plating system'20179,653,350'Pre-treatment method for plating and storage medium'20179,653,354'Metal wiring layer forming method, metal wiring layer forming apparatus, and recording medium'20179,583,330'Supercritical drying method for semiconductor substrate and supercritical drying apparatus'20179,552,994'Plating apparatus, plating method, and storage medium'20179,523,153'Pre-treatment method for plating and storage medium'20169,505,019'Plating apparatus, plating method and storage medium'20169,487,865'Plating apparatus, plating method and storage medium'20169,421,569'Plating apparatus, plating method and storage medium'20169,255,331'Apparatus for plating process'20169,236,280'Substrate processing apparatus, substrate processing method, and storage medium'20168,999,432'Cap metal forming method'20158,937,014'Liquid treatment apparatus and liquid treatment method'20158,771,429'Supercritical drying method for semiconductor substrate and supercritical drying apparatus'20148,770,138'Semiconductor manufacturing apparatus and semiconductor manufacturing method'20148,691,497'Developing treatment method'20148,465,596'Supercritical processing apparatus and supercritical processing method'20138,383,522'Micro pattern forming method'20138,372,212'Supercritical drying method and apparatus for semiconductor substrates'20138,206,785'Cap metal forming method'20128,168,375'Patterning method'20128,168,377'Pattern forming method and method of manufacturing semiconductor device by using the same'20128,062,955'Substrate processing method and substrate processing apparatus'20118,003,509'Semiconductor manufacturing apparatus and semiconductor manufacturing method'20117,989,354'Patterning method'20117,781,342'Substrate treatment method for etching a base film using a resist pattern'20107,754,622'Patterning method utilizing SiBN and photolithography'20107,521,098'Method of processing an organic-film'20097,195,936'Thin film processing method and system'20076,800,546'Film forming method by radiating a plasma on a surface of a low dielectric constant film'20046,683,006'Film forming method and film forming apparatus'20046,660,124'Polishing system and polishing method'20036,120,361'Polishing apparatus, polishing member'20006,106,369'Polishing system'20005,722,875'Method and apparatus for polishing'19985,622,566'Film-forming apparatus'1997

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1997–2021Patents assigned to TOKYO ELECTRON LTD (48)· patent assignee history
1997–2019Based in Nirasaki, JP· patent location history
2010–2019Based in Yamanashi, JP· patent location history
2011–2019Patents assigned to IWASHITA MITSUAKI (19)· patent assignee history
2011–2017Patents assigned to TANAKA TAKASHI (10)· patent assignee history
2012–2019Patents assigned to TOSHIMA TAKAYUKI (9)· patent assignee history
2012–2019Patents assigned to MITSUOKA KAZUYUKI (5)· patent assignee history
2019–2021Based in Koshi, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOKYO ELECTRON LTD481997–2021
IWASHITA MITSUAKIself192011–2019
TANAKA TAKASHI102011–2017
TOSHIMA TAKAYUKI92012–2019
MITSUOKA KAZUYUKI52012–2019
Locations
LocationPatentsSpan
Nirasaki, JP361997–2019
Yamanashi, JP112010–2019
Koshi, JP22019–2021