Inventor

Hung Chih Chen

Inventor
Sunnyvale, CA, US

Overview

167→
Patents
1986–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 167 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing47%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
G06FElectric digital data processing7%
Y10TTechnical subjects covered by former us classification5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
H01LSemiconductor devices2%
B29CShaping or joining of plastics1%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts1%
B29LIndexing scheme associated with subclass b29c, relating to particular articles1%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices1%
PatentTitleYear
11,125,978Optical lens assembly comprising seventh lenses of -++--+- or +++--+- refractive powers, image capturing unit and electronic device202110,766,117Retaining ring with shaped surface202010,702,971Textured membrane for a multi-chamber carrier head202010,602,362Gateway, gateway setup method, and IoT device setup method in IoT system202010,500,694Chemical mechanical polishing apparatus and methods201910,226,853Methods and apparatus for conditioning of chemical mechanical polishing pads201910,207,389Polishing pad configuration and chemical mechanical polishing system201910,105,812Polishing pad configuration and polishing pad support201810,076,817Orbital polishing with small pad201810,022,837Inner retaining ring and outer retaining ring for carrier head20189,987,724Polishing system with pad carrier and conditioning station20189,937,601Retaining ring with Shaped Surface20189,873,179Carrier for small pad for chemical mechanical polishing20189,862,070'Systems and methods for substrate polishing end point detection using improved friction measurement'20189,808,906'Polishing system with front side pressure control'20179,662,762'Modifying substrate thickness profiles'20179,625,951'Supporting base and computer system'20179,529,390'Computer apparatus'20169,492,905'Retaining ring with selected stiffness and thickness'20169,486,893'Conditioning of grooving in polishing pads'20169,471,106'Computer apparatus'20169,452,505'Textured membrane for a multi-chamber carrier head'20169,358,658'Polishing system with front side pressure control'20169,308,623'Multi-disk chemical mechanical polishing pad conditioners and methods'20169,280,178'Portable electronic apparatus and expanding platform thereof'20169,261,917'Portable electronic device capable of pivoting'20169,261,910'Fixing device for fixing a portable electronic device and portable electronic system therewith'20169,254,547'Side pad design for edge pedestal'20169,215,818'Electronic device and hinge structure thereof'20159,201,466'Portable computer'20159,189,015'Computer apparatus'20159,186,773'Retaining ring with shaped surface'20159,165,486'Back plate for use with a backlight module, a backlight module using the same, and the manufacturing method thereof'20159,158,341'Portable computer'20159,122,450'Portable electronic apparatus and casing therefor'20159,119,461'High stiffness, anti-slip scrubber brush assembly, high-stiffness mandrel, subassemblies, and assembly methods'20159,097,407'Slim border design of display device and backlight module thereof'20159,067,295'Monitoring retaining ring thickness and pressure control'20159,061,394'Systems and methods for substrate polishing end point detection using improved friction measurement'20159,050,699'Polishing head zone boundary smoothing'20159,050,700'Methods and apparatus for an improved polishing head retaining ring'20159,040,847'Fastening mechanism and electronic device having the same'20159,042,091'Portable electronic device with hinge structure'20159,017,138'Retaining ring monitoring and control of pressure'20158,998,676'Retaining ring with selected stiffness and thickness'20158,976,519'Portable computer'20158,968,055'Methods and apparatus for pre-chemical mechanical planarization buffing module'20158,922,984'Portable computer'20148,917,500'Portable computer'20148,896,558'Portable computer with adjustable touch screen display'20148,840,446'Inner retaining ring and outer retaining ring for carrier head'20148,808,832'Plate with easy assembly'20148,808,062'Multi-chamber carrier head with a textured membrane'20148,811,604'Sliding mechanism and slider electronic apparatus therewith'20148,724,318'Portable electronic apparatus and casing therefor'20148,721,391'Carrier head with narrow inner ring and wide outer ring'20148,628,378'Method for holding and polishing a substrate'20148,597,084'Textured platen'20138,591,286'Apparatus and method for temperature control during polishing'20138,585,468'Retaining ring with shaped surface'20138,550,879'Polishing pad conditioner'20138,535,121'Retaining ring and articles for carrier head'20138,460,067'Polishing head zone boundary smoothing'20138,454,413'Multi-chamber carrier head with a textured membrane'20138,376,813'Retaining ring and articles for carrier head'20138,337,279'Closed-loop control for effective pad conditioning'20128,298,047'Substrate retainer'20128,250,695'Roller assembly for a brush cleaning device in a cleaning module'20128,221,193'Closed loop control of pad profile based on metrology feedback'20128,181,302'Brush alignment control mechanism'20128,096,852'In-situ performance prediction of pad conditioning disk by closed loop torque monitoring'20128,088,299'Multiple zone carrier head with flexible membrane'20128,066,551'Retaining ring with shaped surface'20118,021,211'Substrate holder with liquid supporting surface'20117,988,535'Platen exhaust for chemical mechanical polishing system'20117,963,826'Apparatus and methods for conditioning a polishing pad'20117,927,190'Retaining ring with shaped surface'20117,883,397'Substrate retainer'20117,842,158'Multiple zone carrier head with flexible membrane'20107,815,787'Electrolyte retaining on a rotating platen by directional air flow'2010D0620013'Keyboard'20107,749,052'Carrier head using flexure restraints for retaining ring alignment'2010D0594461'Keyboard'2009D0594462'Keyboard'20097,527,271'Fast substrate loading on polishing head without membrane inflation step'20097,503,837'Composite retaining ring'20097,497,767'Vibration damping during chemical mechanical polishing'20097,459,057'Substrate retainer'20087,452,264'Pad cleaning method'20087,406,338'Dual display module'20087,344,434'Retaining ring with shaped surface'20087,331,847'Vibration damping in chemical mechanical polishing system'20087,273,408'Paired pivot arm'20077,255,771'Multiple zone carrier head with flexible membrane'20077,255,637'Carrier head vibration damping'20077,241,203'Six headed carousel'20077,207,871'Carrier head with multiple chambers'20077,198,548'Polishing apparatus and method with direct load platen'20077,198,561'Flexible membrane for multi-chamber carrier head'20077,186,171'Composite retaining ring'20077,166,016'Six headed carousel'20077,153,188'Temperature control in a chemical mechanical polishing system'20067,115,024'Profile control platen'20067,101,272'Carrier head for thermal drift compensation'20067,081,042'Substrate removal from polishing tool'20067,048,621'Retaining ring deflection control'20067,044,832'Load cup for chemical mechanical polishing'20067,040,971'Carrier head with a flexible membrane'20067,014,545'Vibration damping in a chemical mechanical polishing system'20067,016,029'Detection of lens anti-reflective coating decay by undesired residue detection'20067,001,260'Carrier head with a compressible film'20067,001,256'Carrier head with a non-stick membrane'20067,001,245'Substrate carrier with a textured membrane'20067,001,257'Multi-chamber carrier head with a flexible membrane'20066,979,250'Carrier head with flexible membrane to provide controllable pressure and loading area'20056,974,371'Two part retaining ring'20056,923,714'Carrier head with a non-stick membrane'20056,913,518'Profile control platen'20056,857,945'Multi-chamber carrier head with a flexible membrane'20056,857,931'Method of detecting a substrate in a carrier head'20056,857,946'Carrier head with a flexure'20056,848,980'Vibration damping in a carrier head'20056,776,694'Methods for carrier head with multi-part flexible membrane'20046,764,387'Control of a multi-chamber carrier head'20046,722,965'Carrier head with flexible membranes to provide controllable pressure and loading area'20046,705,932'Carrier head for chemical mechanical polishing'20046,676,497'Vibration damping in a chemical mechanical polishing system'20046,663,466'Carrier head with a substrate detector'20036,652,912'Method and system for spraying a viscous material on a wafer'20036,575,825'CMP polishing pad'20036,540,594'Carrier head with a flexible membrane for a chemical mechanical polishing system'20036,531,374'Overlay shift correction for the deposition of epitaxial silicon layer and post-epitaxial silicon layers in a semiconductor device'20036,517,415'Carrier head with a substrate detection mechanism for a chemical mechanical polishing system'20036,514,124'Carrier head for chemical mechanical polishing a substrate'20036,511,367'Carrier head with local pressure control for a chemical mechanical polishing apparatus'20036,494,774'Carrier head with pressure transfer mechanism'20026,450,868'Carrier head with multi-part flexible membrane'20026,436,828'Chemical mechanical polishing using magnetic force'20026,436,228'Substrate retainer'20026,431,968'Carrier head with a compressible film'20026,406,361'Carrier head for chemical mechanical polishing'20026,390,908'Determining when to replace a retaining ring used in substrate polishing operations'20026,386,955'Carrier head with a flexible membrane for a chemical mechanical polishing system'20026,368,191'Carrier head with local pressure control for a chemical mechanical polishing apparatus'20026,361,420'Method of chemical mechanical polishing with edge control'20026,277,014'Carrier head with a flexible membrane for chemical mechanical polishing'20016,277,009'Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus'20016,244,932'Method for detecting the presence of a substrate in a carrier head'20016,241,596'Method and apparatus for chemical mechanical polishing using a patterned pad'20016,241,593'Carrier head with pressurizable bladder'20016,220,944'Carrier head to apply pressure to and retain a substrate'20016,217,426'CMP polishing pad'20016,210,255'Carrier head for chemical mechanical polishing a substrate'20016,183,354'Carrier head with a flexible membrane for a chemical mechanical polishing system'20016,165,058'Carrier head for chemical mechanical polishing'20006,162,116'Carrier head for chemical mechanical polishing'20006,159,079'Carrier head for chemical mechanical polishing a substrate'20006,146,259'Carrier head with local pressure control for a chemical mechanical polishing apparatus'20006,132,298'Carrier head with edge control for chemical mechanical polishing'20006,080,050'Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus'20006,064,475'Real time local defocus monitor system using maximum and mean angles of focus correction'20006,050,882'Carrier head to apply pressure to and retain a substrate'20006,021,921'Liquid dispensing system and method for dispensing'20005,993,302'Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus'19995,957,751'Carrier head with a substrate detection mechanism for a chemical mechanical polishing system'19995,869,219'Method for depositing a polyimide film'19994,617,607'High pressure capacitive transducer'1986

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2020Patents assigned to APPLIED MATERIALS INC (132)· patent assignee history
1999–2008Based in San Jose, CA, US· patent location history
2000–2015Based in Hsinchu, TW· patent location history
2004–2011Based in Santa Clara, CA, US· patent location history
2006–2020Based in Sunnyvale, CA, US· patent location history
2011–2019Patents assigned to CHEN HUNG CHIH (20)· patent assignee history
2012–2018Patents assigned to CHANG SHOU-SUNG (7)· patent assignee history
2014–2017Patents assigned to WISTRON CORP (20)· patent assignee history
2014–2015Patents assigned to CHEN HUNG-CHIH (6)· patent assignee history
2014–2017Based in New Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
APPLIED MATERIALS INC1321999–2020
CHEN HUNG CHIHself202011–2019
WISTRON CORP202014–2017
CHANG SHOU-SUNG72012–2018
CHEN HUNG-CHIHself62014–2015
Locations
LocationPatentsSpan
Sunnyvale, California, US642006–2020
San Jose, California, US521999–2008
New Taipei, TW202014–2017
Santa Clara, California, US162004–2011
Hsinchu, TW62000–2015