Inventor
WEIJIE ZHANG
Inventor
US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering9%
B24CAbrasive or related blasting with particulate material9%
B29CShaping or joining of plastics9%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts9%
B29LIndexing scheme associated with subclass b29c, relating to particular articles9%
D03DWoven fabrics9%
F16HGearing9%
F16MFrames, casings or beds of engines, machines or apparatus, not specific to engines, machines or apparatus provided for elsewhere9%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them9%
G06FElectric digital data processing9%
PatentTitleYear
12,168,264Method for laser joining two blanks made of aluminum material202412,017,419Three-dimensional orthogonal woven composite outlet guide vane and manufacturing method thereof202411,904,436Abrasive water jet full-section cutting type cutter head and application devices202411,675,412Attention detection service202311,314,155Elevator assembly and electronic device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Based in TW· patent location history
2023Patents assigned to APPLE INC (1)· patent assignee history
2023–2024Based in US· patent location history
2024Patents assigned to AUTOTECH ENG R&D USA INC (1)· patent assignee history
2024Patents assigned to AUTOTECH ENG SL (1)· patent assignee history
2024Patents assigned to UNIV BEIHANG (1)· patent assignee history
2024Patents assigned to UNIV SHANDONG (1)· patent assignee history
2024Based in CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLE INC | 1 | 2023 |
| AUTOTECH ENG R&D USA INC | 1 | 2024 |
| AUTOTECH ENG SL | 1 | 2024 |
| UNIV BEIHANG | 1 | 2024 |
| UNIV SHANDONG | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 2 | 2023–2024 |
| CN | 2 | 2024 |
| TW | 1 | 2022 |