Inventor
YI-YANG LEI
Inventor
TW
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1028%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form6%
B24BMachines, devices, or processes for grinding or polishing2%
B24DTools for grinding, buffing or sharpening2%
H01QAntennas, i.e. radio aerials2%
PatentTitleYear
12,599,018Package structure with enhancement structure and manufacturing method thereof202612,593,732Semiconductor device and manufacturing method thereof202612,500,113Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor package202512,441,097Lamination process, and manufacturing method of semiconductor package using a chuck202512,391,033Lamination process, and manufacturing method of semiconductor package using a chuck202512,381,176Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer202512,051,666Package structure and manufacturing method of package structure thereof202411,993,066Chuck, lamination process, and manufacturing method of semiconductor package using the same202411,878,388Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same202411,742,317Process including a re-etching process for forming a semiconductor structure202311,587,902Semiconductor structure and method of forming the same202311,569,183Package structure and method of fabricating the same202311,355,466Package structure and manufacturing method of package structure thereof202211,270,921Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (13)· patent assignee history
2022–2026Based in TW· patent location history
2026Patents assigned to TAIWAN SEMICONDUCTOR MFG COMPANY LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 13 | 2022–2026 |
| TAIWAN SEMICONDUCTOR MFG COMPANY LTD | 1 | 2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 14 | 2022–2026 |