Inventor
Shinji Yoshihara
Inventor
Nagoya, JP
Overview
Patents· 32 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B81Cprimary
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
C22CAlloys9%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock9%
C22FChanging the physical structure of non-ferrous metals and non-ferrous alloys8%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure6%
B29CShaping or joining of plastics5%
B81BMicrostructural devices or systems, e.g. micromechanical devices5%
G06FElectric digital data processing4%
PatentTitleYear
10,697,047High strength aluminum alloy extruded material excellent in stress corrosion cracking resistance202010,487,383Method for producing 7000-series aluminum alloy member excellent in stress corrosion cracking resistance20199,657,374'Free-machining aluminum alloy extruded material with reduced surface roughness and excellent productivity'20179,551,054'7xxx series aluminum alloy member excellent in stress corrosion cracking resistance and method for manufacturing the same'20179,206,496'Aluminum alloy extruded material for electro-magnetic forming'20158,876,993'Method for manufacturing an extruded material of heat treatment type Al—Zn—Mg series aluminum alloy'20148,610,246'Semiconductor device capable of restricting coil extension direction and manufacturing method thereof'20137,174,072'Optical device having optical waveguide and method for manufacturing the same'20077,091,109'Semiconductor device and method for producing the same by dicing'20066,995,466'Semiconductor device having passivation cap and method for manufacturing the same'20066,960,487'Method for manufacturing a dynamic quantity detection device'20056,938,501'Semiconductor dynamic quantity sensor'20056,858,451'Method for manufacturing a dynamic quantity detection device'20056,787,929'Semiconductor device having a flat protective adhesive sheet'20046,747,329'Semiconductor sensor chip having diaphragm and method of manufacturing the same'20046,658,948'Semiconductor dynamic quantity sensor'20036,555,901'Semiconductor device including eutectic bonding portion and method for manufacturing the same'20036,450,029'Capacitive physical quantity detection device'20026,429,506'Semiconductor device produced by dicing'20026,421,786'Virtual system time management system utilizing a time storage area and time converting mechanism'20026,313,529'Bump bonding and sealing a semiconductor device with solder'20016,287,885'Method for manufacturing semiconductor dynamic quantity sensor'20016,277,756'Method for manufacturing semiconductor device'20016,255,741'Semiconductor device with a protective sheet to affix a semiconductor chip'20016,245,984'Apparatus and method for composing music data by inputting time positions of notes and then establishing pitches of notes'20016,245,593'Semiconductor device with flat protective adhesive sheet and method of manufacturing the same'20016,059,902'Aluminum alloy of excellent machinability and manufacturing method thereof'20005,835,778'Preinitialized load module modifying system'19985,824,177'Method for manufacturing a semiconductor device'19985,684,995'Segment division management system'19975,668,033'Method for manufacturing a semiconductor acceleration sensor device'19974,975,390'Method of fabricating a semiconductor pressure sensor'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990–1998Patents assigned to NIPPON DENSO CO (3)· patent assignee history
1990Based in Anjo, JP· patent location history
1997–2002Patents assigned to NEC CORP (3)· patent assignee history
1997–2013Based in Nagoya, JP· patent location history
1997–2002Based in Tokyo, JP· patent location history
2000–2020Patents assigned to KOBE STEEL LTD (7)· patent assignee history
2000–2020Based in Shimonoseki, JP· patent location history
2001–2013Patents assigned to DENSO CORP (18)· patent assignee history
2001Based in Hamamatsu, JP· patent location history
2013–2020Patents assigned to YOSHIHARA SHINJI (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DENSO CORP | 18 | 2001–2013 |
| KOBE STEEL LTD | 7 | 2000–2020 |
| NEC CORP | 3 | 1997–2002 |
| NIPPON DENSO CO | 3 | 1990–1998 |
| YOSHIHARA SHINJIself | 3 | 2013–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nagoya, JP | 20 | 1997–2013 |
| Shimonoseki, JP | 7 | 2000–2020 |
| Tokyo, JP | 3 | 1997–2002 |
| Hamamatsu, JP | 1 | 2001 |
| Anjo, JP | 1 | 1990 |