Inventor
Kuang-Chi Chao
Inventor
Kaohsiung, TW
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H10DInorganic electric semiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
PatentTitleYear
7,416,920'Semiconductor device protective structure and method for fabricating the same'20087,400,037'Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP'20087,176,567'Semiconductor device protective structure and method for fabricating the same'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2008Patents assigned to ADVANCED CHIP ENG TECH INC (2)· patent assignee history
2007–2008Based in Kaohsiung, TW· patent location history
2008Patents assigned to ADVANCED CHIP ENGINEERING TACH (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED CHIP ENG TECH INC | 2 | 2007–2008 |
| ADVANCED CHIP ENGINEERING TACH | 1 | 2008 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kaohsiung, TW | 3 | 2007–2008 |