Inventor
David Jandzinski
Inventor
Summerfield, NC, US
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H01LSemiconductor devices21%
H05KPrinted circuits18%
Y10TTechnical subjects covered by former us classification12%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems6%
B23KSoldering or unsoldering3%
G06KGraphical data reading3%
PatentTitleYear
10,905,007Contact pads for electronic substrates and related methods202110,882,740Wafer-level package with enhanced performance and manufacturing method thereof202110,888,040Double-sided module with electromagnetic shielding202110,856,456Double-sided module with electromagnetic shielding202010,773,952Wafer-level package with enhanced performance202010,676,348Wafer-level package with enhanced performance202010,589,993Wafer-level package with enhanced performance202010,549,988Wafer-level package with enhanced performance202010,043,707Additive conductor redistribution layer (ACRL)201810,020,206Encapsulated dies with enhanced thermal performance20189,997,376Encapsulated dies with enhanced thermal performance20189,960,145Flip chip module with enhanced properties20189,960,054Encapsulated dies with enhanced thermal performance20189,929,125'Flip chip module with enhanced properties'20189,929,024'Encapsulated dies with enhanced thermal performance'20189,899,350'Flip chip module with enhanced properties'20189,892,937'Encapsulated dies with enhanced thermal performance'20189,859,132'Encapsulated dies with enhanced thermal performance'20189,613,831'Encapsulated dies with enhanced thermal performance'20179,576,822'Encapsulated dies with enhanced thermal performance'20178,409,658'Conformal shielding process using flush structures'20138,296,941'Conformal shielding employing segment buildup'20125,892,661'Smartcard and method of making'19995,816,478'Fluxless flip-chip bond and a method for making'19985,789,815'Three dimensional semiconductor package having flexible appendages'19985,661,088'Electronic component and method of packaging'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–1999Patents assigned to MOTOROLA INC (4)· patent assignee history
1997–1998Based in Phoenix, AZ, US· patent location history
1999Based in Newark Valley, NY, US· patent location history
2012–2018Patents assigned to RF MICRO DEVICES INC (5)· patent assignee history
2012–2013Patents assigned to HINER DAVID J (2)· patent assignee history
2012–2013Patents assigned to JANDZINSKI DAVID (2)· patent assignee history
2012–2021Based in Summerfield, NC, US· patent location history
2017–2021Patents assigned to QORVO US INC (8)· patent assignee history
2021Based in Kernersville, NC, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| QORVO US INC | 8 | 2017–2021 |
| RF MICRO DEVICES INC | 5 | 2012–2018 |
| MOTOROLA INC | 4 | 1997–1999 |
| HINER DAVID J | 2 | 2012–2013 |
| JANDZINSKI DAVIDself | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Summerfield, NC, US | 21 | 2012–2021 |
| Phoenix, AZ, US | 3 | 1997–1998 |
| Kernersville, NC, US | 1 | 2021 |
| Newark Valley, New York, US | 1 | 1999 |