Inventor
Hiroshige Ohkawa
Inventor
Tokyo, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits27%
Y10TTechnical subjects covered by former us classification20%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form7%
C03CChemical composition of glasses, glazes or vitreous enamels7%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients7%
H01BCables7%
H01LSemiconductor devices7%
H01PWaveguides7%
H01QAntennas, i.e. radio aerials7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
PatentTitleYear
9,635,756'Circuit board incorporating semiconductor IC and manufacturing method thereof'20178,303,752'Method of manufacturing wiring board'20126,908,960'COMPOSITE DIELECTRIC MATERIAL, COMPOSITE DIELECTRIC SUBSTRATE, PREPREG, COATED METAL FOIL, MOLDED SHEET, COMPOSITE MAGNETIC SUBSTRATE, SUBSTRATE, DOUBLE SIDE METAL FOIL-CLAD SUBSTRATE, FLAME RETARDANT SUBSTRATE, POLYVINYLBENZYL ETHER RESIN COMPOSITION, THERMOSETTIN'20056,407,020'Ceramics composition'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2017Patents assigned to TDK CORP (4)· patent assignee history
2002–2017Based in Tokyo, JP· patent location history
2012Patents assigned to KAWABATA KENICHI (1)· patent assignee history
2012Patents assigned to OHKAWA HIROSHIGE (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TDK CORP | 4 | 2002–2017 |
| KAWABATA KENICHI | 1 | 2012 |
| OHKAWA HIROSHIGEself | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 4 | 2002–2017 |