Inventor

Kuan-Lin Ho

Inventor

Hsinchu, TW

Overview

2014–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 34 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%

H01LSemiconductor devices39%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%

H10DInorganic electric semiconductor devices4%

B25HWorkshop equipment, e.g. for marking-out work1%

Y10TTechnical subjects covered by former us classification1%

PatentTitleYear

11,011,431Semiconductor structure and manufacturing method thereof2021 10,957,672Package structure and method of manufacturing the same2021 10,879,140System and method for bonding package lid2020 10,867,835Semiconductor packaging structure and process2020 10,804,245Semiconductor structure and manufacturing method thereof2020 10,777,467Semiconductor structure and manufacturing method thereof2020 10,700,031Integrated fan-out package and manufacturing method thereof2020 10,685,853Lid attach processes for semiconductor packages2020 10,658,263Semiconductor package and manufacturing method thereof2020 10,622,278Semiconductor structure and associated method for manufacturing the same2020 10,515,941Methods of forming package-on-package structures2019 10,468,307Semiconductor structure and manufacturing method thereof2019 10,276,508Semiconductor packages and methods of forming the same2019 10,269,668System and method for bonding package lid2019 10,269,679Semiconductor structure and associated method for manufacturing the same2019 10,163,754Lid design for heat dissipation enhancement of die package2018 10,157,871Integrated fan-out package and manufacturing method thereof2018 10,157,863Method for forming a lid structure for a semiconductor device package2018 10,157,772Semiconductor packaging structure and process2018 9,941,186Method for manufacturing semiconductor structure2018 9,893,043'Method of manufacturing a chip package'2018 9,865,566'Semiconductor structure and manufacturing method thereof'2018 9,859,265'Package structure and methods of forming the same'2018 9,812,410'Lid structure for a semiconductor device package and method for forming the same'2017 9,805,997'Packaging methods for semiconductor devices with encapsulant ring'2017 9,786,520'Semiconductor device and manufacturing method thereof'2017 9,735,043'Semiconductor packaging structure and process'2017 9,673,119'System and method for bonding package lid'2017 9,502,373'Lid attach process and apparatus for fabrication of semiconductor packages'2016 9,415,501'Apparatus for manufacturing a semiconductor device and method of manufacturing a semiconductor device'2016 9,287,233'Adhesive pattern for advance package reliability improvement'2016 9,209,046'Semiconductor device and manufacturing method thereof'2015 9,142,523'Semiconductor device and manufacturing method thereof'2015 8,916,419'Lid attach process and apparatus for fabrication of semiconductor packages'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014–2015Patents assigned to TAIWAN SEMICONDUCTOR MFG (3)· patent assignee history

2014Patents assigned to CHEN CHIN-LIANG (1)· patent assignee history

2014Patents assigned to HO KUAN-LIN (1)· patent assignee history

2014Patents assigned to LIN WEI-TING (1)· patent assignee history

2014–2021Based in Hsinchu, TW· patent location history

2016–2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (31)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	31	2016–2021
TAIWAN SEMICONDUCTOR MFG	3	2014–2015
CHEN CHIN-LIANG	1	2014
HO KUAN-LINself	1	2014
LIN WEI-TING	1	2014

Locations

Location	Patents	Span
Hsinchu, TW	34	2014–2021