Inventor

Yi-Shao Liu

Inventor

Zhubei City, TW

Overview

48→

Patents

2014–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 48 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Nprimary

G01NInvestigating or analysing materials by determining their chemical or physical properties29%

H01LSemiconductor devices13%

H10DInorganic electric semiconductor devices13%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%

B01LChemical or physical laboratory apparatus for general use5%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%

B01JChemical or physical processes, e.g. catalysis or colloid chemistry3%

G01RMeasuring electric variables3%

H10KOrganic electric solid-state devices3%

Y10TTechnical subjects covered by former us classification3%

PatentTitleYear

10,845,450Biosensor calibration system and related method2020 10,823,696Method of fabricating a biological field-effect transistor (BioFET) with increased sensing area2020 10,746,693Biosensor device and related method2020 10,604,756Protection against ionizing radiation and chemotherapy toxicity via latexin regulation2020 10,520,467CMOS compatible BioFET2019 10,509,008Biological device and biosensing method thereof2019 10,502,706Direct sensing BioFETs and methods of manufacture2019 10,478,797Bio-sensing and temperature-sensing integrated circuit2019 10,473,616Backside CMOS compatible BioFET with no plasma induced damage2019 10,429,341Method of using integrated electro-microfluidic probe card2019 10,393,695Integrated circuit device with adaptations for multiplexed biosensing2019 10,184,912Backside sensing BioFET with enhanced performance2019 10,155,244Fluid deposition appartus and method2018 10,145,847Method for forming biochips and biochips with non-organic landings for improved thermal budget2018 10,139,364Integrated circuit device with adaptations for multiplexed biosensing2018 10,124,335Integrated fluidic module2018 10,094,801Amplified dual-gate bio field effect transistor2018 9,976,982Backside sensing BioFET with enhanced performance2018 9,968,927Optical biosensor device2018 9,915,630'Biochip with biosensors and fluidic devices'2018 9,910,009'CMOS compatible BioFET'2018 9,873,100Integrated circuit having temperature-sensing device2018 9,797,976'Biosensor calibration system and related method'2017 9,791,406'CMOS compatible BioFET'2017 9,709,524'Integrated circuit device with adaptations for multiplexed biosensing'2017 9,709,525'Backside CMOS compatible BioFET with no plasma induced damage'2017 9,702,846'Biosensor device and related method'2017 9,689,835'Amplified dual-gate bio field effect transistor'2017 9,625,493'Process control monitoring for biochips'2017 9,616,617'Scalable biochip and method for making'2017 9,523,642'Integrated electro-microfluidic probe card, system and method for using the same'2016 9,493,347'Method of forming a semiconductor device'2016 9,459,234'CMOS compatible BioFET'2016 9,395,326'FET sensing cell and method of improving sensitivity of the same'2016 9,389,199'Backside sensing bioFET with enhanced performance'2016 9,376,713'Label free detection of nucleic acid amplification'2016 9,310,332'Semiconductor device and selective heating thereof'2016 9,121,820'Top-down fabrication method for forming a nanowire transistor device'2015 9,091,647'Direct sensing bioFETs and methods of manufacture'2015 9,080,969'Backside CMOS compatible BioFET with no plasma induced damage'2015 9,034,678'BioMEMS and planar light circuit with integrated package'2015 8,951,716'Surface modification, functionalization and integration of microfluidics and biosensor to form a biochip'2015 8,945,912'DNA sequencing and amplification systems using nanoscale field effect sensor arrays'2015 8,883,021'MEMS nanostructures and methods of forming the same'2014 8,852,875'Methods for counting cells'2014 8,846,416'Method for forming biochips and biochips with non-organic landings for improved thermal budget'2014 8,791,557'Microelectromechanical device with integrated package'2014 8,728,844'Backside CMOS compatible bioFET with no plasma induced damage'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (11)· patent assignee history

2014–2016Patents assigned to LIU YI-SHAO (6)· patent assignee history

2014–2016Patents assigned to BASHIR RASHID (3)· patent assignee history

2014–2016Patents assigned to CHENG CHUN-REN (3)· patent assignee history

2014–2020Based in Zhubei City, TW· patent location history

2014–2016Based in Champaign, IL, US· patent location history

2015–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (31)· patent assignee history

2017–2019Based in Hsinchu County, TW· patent location history

2018Based in Singapore, SG· patent location history

2020Based in Lexington, KY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	31	2015–2020
TAIWAN SEMICONDUCTOR MFG	11	2014–2016
LIU YI-SHAOself	6	2014–2016
BASHIR RASHID	3	2014–2016
CHENG CHUN-REN	3	2014–2016

Locations

Location	Patents	Span
Zhubei City, TW	39	2014–2020
Hsinchu County, TW	3	2017–2019
Champaign, Illinois, US	2	2014–2016
Lexington, KY, US	1	2020
Singapore, SG	1	2018