Inventor
Miyoshi Togawa
Inventor
Oita, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H04NPictorial communication, e.g. television22%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them11%
H01LSemiconductor devices11%
H05KPrinted circuits11%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation11%
PatentTitleYear
10,917,550Electronic component, camera module, and method for manufacturing electronic component202110,720,459Imaging element package and camera module having a slit formed in an adhesive connecting a flexible substrate and another member to address differences in linear expansion coefficients20207,129,578'Substrate for semiconductor device, manufacturing method thereof, semiconductor device, and frame main body'20066,121,686'Ball grid array package having through-holes disposed in the substrate under the chip'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2006Patents assigned to SONY CORP (2)· patent assignee history
2000–2021Based in Oita, JP· patent location history
2020–2021Patents assigned to SONY SEMICONDUCTOR SOLUTIONS CORP (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SONY CORP | 2 | 2000–2006 |
| SONY SEMICONDUCTOR SOLUTIONS CORP | 2 | 2020–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Oita, JP | 4 | 2000–2021 |