Inventor
Kunihiro Komiya
Inventor
Kyoto, JP
Overview
Patents· 25 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H01LSemiconductor devices12%
H05BElectric heating12%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications10%
G09GArrangements or circuits for control of indicating devices using static means to present variable information8%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems6%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein4%
H03MCoding4%
H10DInorganic electric semiconductor devices4%
B01FMixing, e.g. dissolving, emulsifying or dispersing2%
PatentTitleYear
10,665,518Semiconductor device having electrode pads arranged between groups of external electrodes202010,134,250Sensor system201810,134,653Semiconductor device having electrode pads arranged between groups of external electrodes20189,691,678'Semiconductor device having electrode pads arranged between groups of external electrodes'20179,607,945'Semiconductor device comprising power elements in juxtaposition order'20179,391,033'Semiconductor device'20169,006,885'Semiconductor device having electrode pads arranged between groups of external electrodes'20158,653,656'Semiconductor device having multiple external electrodes'20148,593,439'Load driving device, illumination device, display device'20138,405,208'Semiconductor device having semiconductor substrate electrode pads, and external electrodes'20138,355,111'Load driving device, illumination device, display device'20138,305,011'Driving circuit for light emitting elements'20128,134,238'Semiconductor device having a wafer level chip size package structure'20128,111,006'Light emitting diode driving apparatus'20127,851,929'Semiconductor device'20107,679,351'Power supply apparatus'20107,622,900'Semiconductor integrated circuit supplying voltage to a load using a charge pump and electronic device including the same'20097,570,084'Semiconductor integrated circuit outputting detection signal based on detection result of a detecting device and electronic device including the same'20097,453,711'Step-up power supply unit and portable apparatus utilizing the same'20087,443,327'Current-output type digital-to-analog converter'20087,342,312'Semiconductor device'20087,265,395'Semiconductor device'20077,157,866'Light emitting element driving device and portable apparatus equipped with light emitting elements'20077,057,839'Magnetic recording apparatus'20067,046,082'Electronic device having sound output module'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2020Patents assigned to ROHM CO LTD (25)· patent assignee history
2006–2018Based in Kyoto, JP· patent location history
2012–2013Patents assigned to KOMIYA KUNIHIRO (5)· patent assignee history
2012Patents assigned to KITAGAWA ATSUSHI (1)· patent assignee history
2012Patents assigned to SAWADA HIROSHI (1)· patent assignee history
2020Based in Ukyo-Ku, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ROHM CO LTD | 25 | 2006–2020 |
| KOMIYA KUNIHIROself | 5 | 2012–2013 |
| KITAGAWA ATSUSHI | 1 | 2012 |
| SAWADA HIROSHI | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kyoto, JP | 24 | 2006–2018 |
| Ukyo-Ku, JP | 1 | 2020 |