Inventor
WAI LING LEE
Inventor
MY
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H10DInorganic electric semiconductor devices25%
PatentTitleYear
12,112,997Micro through-silicon via for transistor density scaling202412,080,628Micro through-silicon via for transistor density scaling202411,652,026Micro through-silicon via for transistor density scaling202311,398,415Stacked through-silicon vias for multi-device packages202211,393,741Micro through-silicon via for transistor density scaling202211,393,758Power delivery for embedded interconnect bridge devices and methods2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to INTEL CORP (6)· patent assignee history
2022–2024Based in MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 6 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| MY | 6 | 2022–2024 |