Inventor
WEN-KUEI LIU
Inventor
TW
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
B24BMachines, devices, or processes for grinding or polishing9%
C09GPolishing compositions9%
G01NInvestigating or analysing materials by determining their chemical or physical properties9%
G06TImage data processing or generation, in general9%
A63CSkates4%
B60YIndexing scheme relating to aspects cross-cutting vehicle technology4%
B62MRider propulsion of wheeled vehicles or sledges4%
F16DCouplings for transmitting rotation4%
PatentTitleYear
12,368,063Wafer taping apparatus and method202511,901,226Method for forming an interconnect structure202411,872,471Braking mechanism of a wheeled device202411,642,754Slurry recycling for chemical mechanical polishing system202311,430,677Wafer taping apparatus and method202211,312,882CMP slurry solution for hardened fluid material202211,305,839Transmission device for bicycle202211,244,834Slurry recycling for chemical mechanical polishing system2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (6)· patent assignee history
2022–2024Patents assigned to LIU CHAO HSUAN (2)· patent assignee history
2022–2024Patents assigned to LIU WEN KUEI (2)· patent assignee history
2022–2024Patents assigned to LIU YU CHUN (2)· patent assignee history
2022–2024Patents assigned to Liu yi shan (2)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 6 | 2022–2025 |
| LIU CHAO HSUAN | 2 | 2022–2024 |
| LIU WEN KUEIself | 2 | 2022–2024 |
| LIU YU CHUN | 2 | 2022–2024 |
| Liu yi shan | 2 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 8 | 2022–2025 |