Inventor
Nobuhisa Takakusaki
Inventor
Gunma, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H05KPrinted circuits29%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
Y10TTechnical subjects covered by former us classification10%
A47JKitchen equipment5%
H10DInorganic electric semiconductor devices5%
Y02PClimate change mitigation technologies in the production or processing of goods5%
PatentTitleYear
7,854,062'Method for manufacturing circuit device'20107,565,738'Method for manufacturing circuit device'20097,439,614'Circuit device with dummy elements'20087,232,957'Hybrid integrated circuit device and method of manufacturing the same'20077,199,468'Hybrid integrated circuit device with high melting point brazing material'20076,972,477'Circuit device with conductive patterns separated by insulating resin-filled grooves'20056,946,724'Circuit device and method of manufacture thereof'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005Patents assigned to KANTO SANYO SEMICONDUCTORS CO (2)· patent assignee history
2005–2010Based in Gunma, JP· patent location history
2007–2010Patents assigned to SANYO ELECTRIC CO (5)· patent assignee history
2007Based in Ota, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SANYO ELECTRIC CO | 5 | 2007–2010 |
| KANTO SANYO SEMICONDUCTORS CO | 2 | 2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Gunma, JP | 6 | 2005–2010 |
| Ota, JP | 1 | 2007 |