Inventor

John Trezza

Inventor

Nashua, NH, US

Overview

108→

Patents

1999–2019

Patent span

Electricity

Primary field (CPC H)

Patents· 108 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%

H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light14%

G02BOptical elements, systems or apparatus11%

H10DInorganic electric semiconductor devices9%

Y10TTechnical subjects covered by former us classification5%

H10HInorganic light-emitting semiconductor devices having potential barriers4%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%

H04BTransmission3%

H01LSemiconductor devices2%

PatentTitleYear

10,340,239Tooling for coupling multiple electronic chips2019 9,754,907'Tooling for coupling multiple electronic chips'2017 9,324,629'Tooling for coupling multiple electronic chips'2016 9,147,635'Contact-based encapsulation'2015 8,860,083'Low noise hybridized detector using charge transfer'2014 8,846,445'Inverse chip connector'2014 8,766,159'Multicolor detectors and applications thereof'2014 8,643,186'Processed wafer via'2014 8,499,434'Method of making a capacitive sensor'2013 8,456,015'Triaxial through-chip connection'2013 8,399,820'Multicolor detectors and applications thereof'2013 8,283,778'Thermally balanced via'2012 8,232,194'Process for chip capacitive coupling'2012 8,197,627'Pin-type chip tooling'2012 8,197,626'Rigid-backed, membrane-based chip tooling'2012 8,154,131'Profiled contact'2012 8,093,729'Electrically conductive interconnect system and method'2012 8,084,851'Side stacking apparatus and method'2011 8,067,312'Coaxial through chip connection'2011 8,053,903'Chip capacitive coupling'2011 8,021,922'Remote chip attachment'2011 7,989,958'Patterned contact'2011 7,969,015'Inverse chip connector'2011 7,969,192'Variable off-chip drive'2011 7,960,210'Ultra-thin chip packaging'2011 7,946,331'Pin-type chip tooling'2011 7,942,182'Rigid-backed, membrane-based chip tooling'2011 7,932,584'Stacked chip-based system and method'2011 7,919,870'Coaxial through chip connection'2011 7,884,483'Chip connector'2011 7,871,927'Wafer via formation'2011 7,850,060'Heat cycle-able connection'2010 7,851,348'Routingless chip architecture'2010 7,847,412'Isolating chip-to-chip contact'2010 7,838,997'Remote chip attachment'2010 7,831,151'Redundant optical device array'2010 7,808,111'Processed wafer via'2010 7,803,693'Bowed wafer hybridization compensation'2010 7,786,592'Chip capacitive coupling'2010 7,785,987'Isolating chip-to-chip contact'2010 7,785,931'Chip-based thermo-stack'2010 7,781,886'Electronic chip contact structure'2010 7,767,493'Post & penetration interconnection'2010 7,748,116'Mobile binding in an electronic connection'2010 7,705,632'Variable off-chip drive'2010 7,705,613'Sensitivity capacitive sensor'2010 7,687,397'Front-end processed wafer having through-chip connections'2010 7,687,400'Side stacking apparatus and method'2010 7,670,874'Plated pillar package formation'2010 7,659,202'Triaxial through-chip connection'2010 7,598,163'Post-seed deposition process'2009 7,560,813'Chip-based thermo-stack'2009 7,538,033'Post-attachment chip-to-chip connection'2009 7,534,722'Back-to-front via process'2009 7,521,806'Chip spanning connection'2009 7,482,272'Through chip connection'2009 7,289,547'Laser and detector device'2007 7,215,032'Triaxial through-chip connection'2007 7,157,372'Coaxial through chip connection'2007 7,092,424'Integrated arrays of modulators and lasers on electronics'2006 7,077,577'Multi-piece fiber optic component and manufacturing technique'2006 7,027,203'Combination micromachine and optical device array'2006 7,020,400'Multi-wavelength optical communication system'2006 6,989,945'Long-throw, tight focusing optical coupler'2006 6,956,244'Opto-electronic device integration'2005 6,945,701'Multi-piece fiber optic component and manufacturing technique'2005 6,899,465'Multi-piece fiber optic component and manufacturing technique'2005 6,889,010'Star topology network with fiber interconnect on chip'2005 6,880,980'Optical fiber ferrule'2005 6,814,498'Integration of fused glass collimated coupler for use in opto-electronic modules'2004 6,790,691'Opto-electronic device integration'2004 6,788,895'Security mapping and auto reconfiguration'2004 6,773,166'Multi-piece fiber optic component and manufacturing technique'2004 6,775,308'Multi-wavelength semiconductor laser arrays and applications thereof'2004 6,771,860'Module mounted aligning optical connector'2004 6,753,197'Opto-electronic device integration'2004 6,731,665'Laser arrays for high power fiber amplifier pumps'2004 6,724,794'Opto-electronic device integration'2004 6,722,788'Integration of fused glass collimated coupler for use in opto-electronic modules'2004 6,693,712'High rate optical correlator implemented on a substrate'2004 6,686,216'Electro-optical transceiver system with controlled lateral leakage and method of making it'2004 6,673,642'Electro-optical transceiver system with controlled lateral leakage and method of making it'2004 6,674,971'Optical communication network with receiver reserved channel'2004 6,656,757'Electro-optical transceiver system with controlled lateral leakage and method of making it'2003 6,633,421'Integrated arrays of modulators and lasers on electronics'2003 6,620,642'Opto-electronic device integration'2003 6,614,744'Method and apparatus for reading out and writing to an optical disc'2003 6,609,835'Oxidized light guiding component and manufacturing technique'2003 6,604,866'Optical fiber ferrule'2003 D0477312'Communication module'2003 D0476979'Communication module'2003 D0476981'Communication module'2003 D0476978'Communication module'2003 D0476980'Communication module'2003 D0476982'Communication interface'2003 6,567,963'Wafer scale integration and remoted subsystems using opto-electronic transceivers'2003 6,538,791'Method and apparatus for real time optical correlation'2003 6,527,456'Cluster integration approach to optical transceiver arrays and fiber bundles'2003 6,485,993'Method of making opto-electronic devices using sacrificial devices'2002 6,485,995'Electro-optical transceiver system with controlled lateral leakage and method of making it'2002 6,453,081'Optoelectronic device with integrated passive optical elements and method'2002 6,447,174'Active optical interconnect'2002 6,434,308'Optoelectronic connector system'2002 6,423,560'Method of making an optoelectronic device using multiple etch stop layers'2002 6,344,664'Electro-optical transceiver system with controlled lateral leakage and method of making it'2002 6,337,265'Method for integration of integrated circuit devices'2002 6,316,286'Method of equalizing device heights on a chip'2001 5,909,303'Optical modulator and optical modulator array'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2019Based in Nashua, NH, US· patent location history

2001–2004Patents assigned to TERACONNECT INC (15)· patent assignee history

2003–2006Patents assigned to XANOPTIX INC (25)· patent assignee history

2009–2016Patents assigned to TREZZA JOHN (40)· patent assignee history

2009–2015Patents assigned to CALLAHAN JOHN (5)· patent assignee history

2010–2014Based in Manalapan, NJ, US· patent location history

2011–2019Patents assigned to CUFER ASSET LTD LLC (28)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TREZZA JOHNself	40	2009–2016
CUFER ASSET LTD LLC	28	2011–2019
XANOPTIX INC	25	2003–2006
TERACONNECT INC	15	2001–2004
CALLAHAN JOHN	5	2009–2015

Locations

Location	Patents	Span
Nashua, NH, US	104	1999–2019
Manalapan, New Jersey, US	4	2010–2014