Inventor

Robert P. Chebi

Inventor
San Carlos, CA, US

Overview

25→
Patents
1994–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 25 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1031%
H01JElectric discharge tubes or discharge lamps24%
H01LSemiconductor devices9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
B08BCleaning in general3%
C03CChemical composition of glasses, glazes or vitreous enamels3%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
10,037,883Enhanced productivity for an etch system through polymer management20189,865,472'Fabrication of a silicon structure and deep silicon etch with profile control'20189,857,307'Elevated surface enhanced Raman spectroscopy resonator structures and method of making same'20189,719,931'Surface enhanced raman spectroscopy resonator structures and methods of making same'20179,673,069'High frequency filter for improved RF bias signal stability'20179,330,926'Fabrication of a silicon structure and deep silicon etch with profile control'20169,318,341'Methods for etching a substrate'20169,018,098'Silicon etch with passivation using chemical vapor deposition'20158,757,178'Method and apparatus for removing photoresist'20148,598,037'Silicon etch with passivation using plasma enhanced oxidation'20138,425,682'High strip rate downstream chamber'20138,298,336'High strip rate downstream chamber'20128,173,547'Silicon etch with passivation using plasma enhanced oxidation'20128,043,434'Method and apparatus for removing photoresist'20117,824,519'Variable volume plasma processing chamber and associated methods'20107,605,063'Photoresist stripping chamber and methods of etching photoresist on substrates'20097,547,635'Process for etching dielectric films with improved resist and/or etch profile characteristics'20097,476,291'High chamber temperature process and chamber design for photo-resist stripping and post-metal etch passivation'20097,083,903'Methods of etching photoresist on substrates'20066,759,336'Methods for reducing contamination of semiconductor substrates'20046,528,427'Methods for reducing contamination of semiconductor substrates'20036,241,845'Apparatus for reducing process drift in inductive coupled plasma etching such as oxide layer'20016,048,798'Apparatus for reducing process drift in inductive coupled plasma etching such as oxide layer'20005,451,543'Straight sidewall profile contact opening to underlying interconnect and method for making the same'19955,279,865'High throughput interlevel dielectric gap filling process'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–1995Based in Austin, TX, US· patent location history
2000–2018Patents assigned to LAM RES CORP (18)· patent assignee history
2000–2001Based in Mountain View, CA, US· patent location history
2003–2009Based in Fremont, CA, US· patent location history
2006Based in Foster City, CA, US· patent location history
2009–2018Based in San Carlos, CA, US· patent location history
2012–2016Patents assigned to CHEBI ROBERT P (6)· patent assignee history
2012–2016Patents assigned to WINNICZEK JAROSLAW W (6)· patent assignee history
2016–2018Patents assigned to APPLIED MATERIALS INC (3)· patent assignee history
2017–2018Patents assigned to OPTOKEY INC (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
LAM RES CORP182000–2018
CHEBI ROBERT Pself62012–2016
WINNICZEK JAROSLAW W62012–2016
APPLIED MATERIALS INC32016–2018
OPTOKEY INC22017–2018
Locations
LocationPatentsSpan
San Carlos, California, US172009–2018
Fremont, California, US32003–2009
Mountain View, California, US22000–2001
Austin, Texas, US21994–1995
Foster City, California, US12006