Inventor

Matthew Meitl

Inventor

Durham, NC, US

Overview

2009–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 147 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%

H01LSemiconductor devices14%

H10HInorganic light-emitting semiconductor devices having potential barriers11%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%

H10DInorganic electric semiconductor devices7%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution4%

B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems3%

Y02PClimate change mitigation technologies in the production or processing of goods3%

B82YSpecific uses or applications of nanostructures3%

PatentTitleYear

11,127,889Displays with unpatterned layers of light-absorbing material2021 11,127,812Devices with a single metal layer2021 11,101,417Structures and methods for electrically connecting printed components2021 11,094,870Surface-mountable pixel packages and pixel engines2021 11,088,121Printed LED arrays with large-scale uniformity2021 11,088,268Methods and devices for fabricating and assembling printable semiconductor elements2021 11,067,643Magnetic field sensor and method for making same2021 11,037,912LED color displays with multiple LEDs connected in series and parallel in different sub-pixels of a pixel2021 11,024,608Structures and methods for electrical connection of micro-devices and substrates2021 10,985,143Micro assembled LED displays and lighting elements2021 10,964,583Micro-transfer-printable flip-chip structures and methods2021 10,944,027Pixel modules with controllers and light emitters2021 10,943,931Wafers with etchable sacrificial patterns, anchors, tethers, and printable devices2021 10,937,679High-precision printed structures2021 10,930,623Micro-transfer printable electronic component2021 10,917,953Electrically parallel fused LEDs2021 10,832,935Multi-level micro-device tethers2020 10,833,225Micro assembled LED displays and lighting elements2020 10,796,971Pressure-activated electrical interconnection with additive repair2020 10,796,938Micro-transfer printing with selective component removal2020 10,782,002LED optical components2020 10,777,521Printable component structure with electrical contact2020 10,749,093Interconnection by lateral transfer printing2020 10,748,793Printing component arrays with different orientations2020 10,714,374High-precision printed structures2020 10,714,001Micro-light-emitting-diode displays2020 10,690,920Displays with transparent bezels2020 10,620,277Magnetic field sensor and method for making same2020 10,600,671Micro-transfer-printable flip-chip structures and methods2020 10,593,827Device source wafers with patterned dissociation interfaces2020 10,573,544Micro-transfer printing with selective component removal2020 10,522,710Printable inorganic semiconductor structures2019 10,522,575Methods of making printable device wafers with sacrificial layers2019 10,510,937Interconnection by lateral transfer printing2019 10,505,079Flexible devices and methods using laser lift-off2019 10,504,882Optical systems fabricated by printing-based assembly2019 10,475,773Method for producing a semiconductor component and a semiconductor component2019 10,475,876Devices with a single metal layer2019 10,468,363Chiplets with connection posts2019 10,468,398Efficiently micro-transfer printing micro-scale devices onto large-format substrates2019 10,453,826Voltage-balanced serial iLED pixel and display2019 10,446,719Micro assembled LED displays and lighting elements2019 10,431,487Micro-transfer-printable flip-chip structures and methods2019 10,431,719Display with color conversion2019 10,424,572Optical systems fabricated by printing-based assembly2019 10,418,501Wafer-integrated, ultra-low profile concentrated photovoltaics (CPV) for space applications2019 10,416,425Concentrator-type photovoltaic (CPV) modules, receiver and sub-receivers and methods of forming same2019 10,395,966Micro-transfer-printable flip-chip structures and methods2019 10,396,238Printable inorganic semiconductor structures2019 10,395,582Parallel redundant chiplet system with printed circuits for reduced faults2019 10,380,930Heterogeneous light emitter display system2019 10,381,430Redistribution layer for substrate contacts2019 10,374,072Methods and devices for fabricating and assembling printable semiconductor elements2019 10,361,180Optical systems fabricated by printing-based assembly2019 10,361,677Transverse bulk acoustic wave filter2019 10,361,124Systems and methods for controlling release of transferable semiconductor structures2019 10,355,113Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics2019 10,347,535Systems and methods for controlling release of transferable semiconductor structures2019 10,347,168Spatially dithered high-resolution2019 10,312,405Systems and methods for preparing GaN and related materials for micro assembly2019 10,297,585Multi-resolution compound micro-devices2019 10,252,514Apparatus and methods for micro-transfer-printing2019 10,255,834Parallel redundant chiplet system for controlling display pixels2019 10,230,048OLEDs for micro transfer printing2019 10,224,231Micro-transfer-printable flip-chip structures and methods2019 10,223,962Display with fused LEDs2019 10,224,460Micro assembled LED displays and lighting elements2019 10,222,698Chiplets with wicking posts2019 10,217,730Efficiently micro-transfer printing micro-scale devices onto large-format substrates2019 10,200,013Micro-transfer-printed acoustic wave filter device2019 10,181,483Laser assisted transfer welding process2019 10,181,507Display tile structure and tiled display2019 10,163,735Pressure-activated electrical interconnection by micro-transfer printing2018 10,163,945Printable device wafers with sacrificial layers2018 10,164,404Crystalline color-conversion device2018 10,157,880Micro-transfer printing with volatile adhesive layer2018 10,153,256Micro-transfer printable electronic component2018 10,153,257Micro-printed display2018 10,109,764Printable inorganic semiconductor structures2018 10,103,069Pressure-activated electrical interconnection by micro-transfer printing2018 10,102,794Distributed charge-pump power-supply system2018 10,074,768Printable inorganic semiconductor method2018 10,050,351Multilayer printed capacitors2018 10,037,985Compound micro-transfer-printed power transistor device2018 10,027,181Layers of safety and failsafe capability for operation of class IV laser in consumer electronics devices2018 9,991,423Micro assembled LED displays and lighting elements2018 9,991,413Systems and methods for preparing GaN and related materials for micro assembly2018 9,991,163Small-aperture-ratio display with electrical component2018 9,947,584Systems and methods for controlling release of transferable semiconductor structures2018 9,929,053'Systems and methods for controlling release of transferable semiconductor structures'2018 9,923,133'Structures and methods for testing printable integrated circuits'2018 9,899,465'Redistribution layer for substrate contacts'2018 9,899,432'Printable device wafers with sacrificial layers gaps'2018 9,887,180'Method for producing a semiconductor component and a semiconductor component'2018 9,871,345'Crystalline color-conversion device'2018 9,865,600'Printed capacitors'2018 9,818,725'Inorganic-light-emitter display with integrated black matrix'2017 9,799,794'Printable inorganic semiconductor structures'2017 9,786,646'Matrix addressed device repair'2017 9,773,945'Method for producing a semiconductor component and a semiconductor component'2017 9,768,086'Methods and devices for fabricating and assembling printable semiconductor elements'2017 9,761,754'Systems and methods for preparing GaN and related materials for micro assembly'2017 9,761,444'Methods and devices for fabricating and assembling printable semiconductor elements'2017 9,741,785'Display tile structure and tiled display'2017 9,716,082'Micro assembled hybrid displays and lighting elements'2017 9,704,821'Stamp with structured posts'2017 9,705,042'Micro assembled LED displays and lighting elements'2017 9,698,308'Micro assembled LED displays and lighting elements'2017 9,640,715'Printable inorganic semiconductor structures'2017 9,601,356'Systems and methods for controlling release of transferable semiconductor structures'2017 9,601,671'Optical systems fabricated by printing-based assembly'2017 9,550,353'Apparatus and methods for micro-transfer-printing'2017 9,537,069'Inorganic light-emitting diode with encapsulating reflector'2017 9,520,537'Micro assembled LED displays and lighting elements'2016 9,450,043'Methods and devices for fabricating and assembling printable semiconductor elements'2016 9,444,015'Micro assembled LED displays and lighting elements'2016 9,443,883'Methods of forming printable integrated circuit devices and devices formed thereby'2016 9,437,782'Micro assembled LED displays and lighting elements'2016 9,434,150'Apparatus and methods for micro-transfer-printing'2016 9,368,683'Printable inorganic semiconductor method'2016 9,358,775'Apparatus and methods for micro-transfer-printing'2016 9,362,113'Engineered substrates for semiconductor epitaxy and methods of fabricating the same'2016 9,355,854'Methods of fabricating printable compound semiconductor devices on release layers'2016 9,349,900'Release strategies for making transferable semiconductor structures, devices and device components'2016 9,343,363'Through-silicon vias and interposers formed by metal-catalyzed wet etching'2016 9,324,733'Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics'2016 9,161,448'Laser assisted transfer welding process'2015 9,142,468'Structures and methods for testing printable integrated circuits'2015 9,117,940'Optical systems fabricated by printing-based assembly'2015 9,049,797'Electrically bonded arrays of transfer printed active components'2015 9,040,425'Methods of forming printable integrated circuit devices and devices formed thereby'2015 8,895,406'Release strategies for making transferable semiconductor structures, devices and device components'2014 8,877,648'Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby'2014 8,729,524'Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics'2014 8,722,458'Optical systems fabricated by printing-based assembly'2014 8,664,699'Methods and devices for fabricating and assembling printable semiconductor elements'2014 8,470,701'Printable, flexible and stretchable diamond for thermal management'2013 8,440,546'Methods and devices for fabricating and assembling printable semiconductor elements'2013 8,394,706'Printable semiconductor structures and related methods of making and assembling'2013 8,217,381'Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics'2012 8,039,847'Printable semiconductor structures and related methods of making and assembling'2011 7,982,296'Methods and devices for fabricating and assembling printable semiconductor elements'2011 7,972,875'Optical systems fabricated by printing-based assembly'2011 7,943,491'Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp'2011 7,932,123'Release strategies for making transferable semiconductor structures, devices and device components'2011 7,799,699'Printable semiconductor structures and related methods of making and assembling'2010 7,622,367'Methods and devices for fabricating and assembling printable semiconductor elements'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2021Patents assigned to UNIV ILLINOIS (28)· patent assignee history

2009–2011Based in Champaign, IL, US· patent location history

2011–2021Based in Durham, NC, US· patent location history

2011–2016Based in Raleigh, NC, US· patent location history

2012–2019Patents assigned to MEITL MATTHEW (13)· patent assignee history

2014–2019Patents assigned to SEMPRIUS INC (15)· patent assignee history

2016–2021Patents assigned to X CELEPRINT LTD (89)· patent assignee history

2020–2021Patents assigned to X DISPLAY COMPANY TECH LTD (25)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
X CELEPRINT LTD	89	2016–2021
UNIV ILLINOIS	28	2009–2021
X DISPLAY COMPANY TECH LTD	25	2020–2021
SEMPRIUS INC	15	2014–2019
MEITL MATTHEWself	13	2012–2019

Locations

Location	Patents	Span
Durham, NC, US	134	2011–2021
Raleigh, NC, US	10	2011–2016
Champaign, Illinois, US	3	2009–2011