Inventor
Bruno Michel
Inventor
Adliswil, CH
Overview
Patents· 94 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H05KPrinted circuits7%
H01LSemiconductor devices6%
Y10TTechnical subjects covered by former us classification5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
G06FElectric digital data processing4%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry4%
B82YSpecific uses or applications of nanostructures4%
H10DInorganic electric semiconductor devices4%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
PatentTitleYear
10,972,047Photovoltaic module202110,972,048Photovoltaic module202110,882,145Adsorption heat exchanger devices202110,688,553Solid sorption refrigeration202010,683,776Device and method for converting heat into mechanical energy202010,622,294Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly202010,586,760Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly202010,564,091Optical sensing device with multiple field-enhanced nano-volumes202010,533,779Adsorption heat exchanger devices202010,471,418Selectively functionalized porous material201910,320,328Photovoltaic thermal hybrid systems and method of operation thereof201910,278,306Method and device for cooling a heat generating component201910,091,909Method and device for cooling a heat generating component201810,050,165Photovoltaic system with non-uniformly cooled photovoltaic cells201810,041,709Adsorption heat exchanger devices201810,031,562Cooling electronic components and supplying power to the electronic components20189,985,147Light-reflecting grating structure for photovoltaic devices20189,951,977Adsorbing heat exchanger20189,905,506'Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly'20189,905,505'Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly'20189,880,595'Cooling device with nested chambers for computer hardware'20189,855,595'Solid sorption refrigeration'20189,821,418'Adsorption heat exchanger devices'20179,739,179'Working fluid for a device, device and method for converting heat into mechanical energy'20179,630,862'Desalination system and method for desalination'20179,591,791'System and method for cooling and delivering power to a computer system'20179,471,089'Electronic circuit device with electromagnetic clock signal conveyed along cooling fluid conduit network'20169,437,766'Photovoltaic thermal hybrid systems and method of operation thereof'20169,416,031'Desalination system and method for desalination'20169,398,730'Fluid-cooled electronic circuit device with cooling fluid conduits having optical transmission medium'20169,337,122'Transferring heat through an optical layer of integrated circuitry'20169,304,533'Electronic circuit device with electromagnetic clock signal conveyed along cooling fluid conduit network'20169,252,072'Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly'20169,252,071'Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly'20169,219,183'Photovoltaic thermal hybrid solar receivers'20159,153,722'Photovoltaic module cooling devices'20159,110,056'Surface treatment'20159,064,080'Transferring heat through an optical layer of integrated circuitry'20159,058,461'Transferring heat through an optical layer of integrated circuitry'20158,989,532'Integrated circuit package connected to an optical data transmission medium using a coolant'20158,805,132'Integrated circuit package connected to a data transmission medium'20148,659,898'Integrated circuit stack'20148,629,554'Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly'20148,487,427'Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly'20138,476,112'Optimized semiconductor packaging in a three-dimensional stack'20138,453,569'Stamp with permeable hydrophylic matrix'20138,427,833'Thermal power plane for integrated circuits'20138,413,712'Cooling device'20138,405,998'Heat sink integrated power delivery and distribution for integrated circuits'20138,363,402'Integrated circuit stack'20138,336,456'Printing in a medium'20128,327,540'Patterned structure for a thermal interface'20128,268,544'Stamp for patterning, method for manufacturing such stamp and method for manufacturing an object using the stamp'20128,268,563'Method and apparatus for surface treatment'20128,267,011'Stamp with drainage channels for transferring a pattern in the presence of a third medium'20128,253,234'Optimized semiconductor packaging in a three-dimensional stack'20128,107,234'Variable flow computer cooling system for a data center and method of operation'20128,106,505'Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly'20128,049,207'Organic optoelectronic device'20118,004,832'Variable flow computer cooling system for a data center and method of operation'20117,928,565'Semiconductor device with a high thermal dissipation efficiency'20117,891,295'Printing in a medium'20117,866,173'Variable performance server system and method of operation'20117,808,780'Variable flow computer cooling system for a data center and method of operation'20107,748,440'Patterned structure for a thermal interface'20107,740,472'Method and device for flowing a liquid on a surface'20107,713,789'Semiconductor device with a high thermal dissipation efficiency'20107,547,582'Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies'20097,532,475'Semiconductor chip assembly with flexible metal cantilevers'20097,504,038'System, method, and apparatus for mechanically releasable slider processing including lapping, air bearing patterning, and debonding'20097,446,057'Fabrication method'20087,434,512'Printing in a medium'20087,329,111'Method and device for flowing a liquid on a surface'20087,306,970'Method and apparatus for manufacturing an optoelectronic device'20077,282,799'Thermal interface with a patterned structure'20077,271,034'Semiconductor device with a high thermal dissipation efficiency'20077,255,153'High performance integrated MLC cooling device for high power density ICS and method for manufacturing'20077,238,906'Electrical switch of the normally closed type'20077,235,464'Patterning method'20077,168,939'System, method, and apparatus for multilevel UV molding lithography for air bearing surface patterning'20077,070,922'Surface treatment'20067,041,232'Selective etching of substrates with control of the etch profile'20066,798,464'Liquid crystal display'20046,794,589'Multiple electrical switch arrangement'20046,767,828'Method for forming patterns for semiconductor devices'20046,596,346'Silicone elastomer stamp with hydrophilic surfaces and method of making same'20036,569,575'Optical lithography beyond conventional resolution limits'20036,537,499'Method and device for identification of a substance'20036,521,285'Method for printing a catalyst on substrates for electroless deposition'20036,096,386'Method of oriented depositing chemically defined bodies'20005,925,259'Lithographic surface or thin layer modification'19995,817,242'Stamp for a lithographic process'19985,804,709'Cantilever deflection sensor and use thereof'19985,237,493'Current-to-voltage converter with low noise, wide bandwidth and high dynamic range'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2021Patents assigned to IBM (86)· patent assignee history
1993–1999Based in Gattikon, CH· patent location history
2000–2020Based in Adliswil, CH· patent location history
2011–2020Based in Rueschlikon, CH· patent location history
2011–2012Based in Yorktown Heights, NY, US· patent location history
2012–2020Patents assigned to MICHEL BRUNO (25)· patent assignee history
2012–2015Patents assigned to BRUNSCHWILER THOMAS (10)· patent assignee history
2012–2015Patents assigned to BAROWSKI HARRY (7)· patent assignee history
2012–2015Patents assigned to HARRER HUBERT (7)· patent assignee history
2012–2021Based in Zurich, CH· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 86 | 1993–2021 |
| MICHEL BRUNOself | 25 | 2012–2020 |
| BRUNSCHWILER THOMAS | 10 | 2012–2015 |
| BAROWSKI HARRY | 7 | 2012–2015 |
| HARRER HUBERT | 7 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Adliswil, CH | 40 | 2000–2020 |
| Zurich, CH | 28 | 2012–2021 |
| Rueschlikon, CH | 17 | 2011–2020 |
| Gattikon, CH | 4 | 1993–1999 |
| Yorktown Heights, New York, US | 2 | 2011–2012 |