Inventor

Phillip W. Barth

Inventor
Portola Valley, CA, US

Overview

54→
Patents
1984–2020
Patent span
Performing operations
Primary field (CPC B)

Patents· 54 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B41Jprimary
B41JTypewriters12%
Y10TTechnical subjects covered by former us classification12%
G01NInvestigating or analysing materials by determining their chemical or physical properties11%
G02BOptical elements, systems or apparatus8%
B01LChemical or physical laboratory apparatus for general use5%
B81BMicrostructural devices or systems, e.g. micromechanical devices5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure4%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry3%
B82YSpecific uses or applications of nanostructures3%
PatentTitleYear
10,537,676Sensing system for medication delivery device20208,907,433'Thin film with improved temperature range'20148,563,237'Biopolymer resonant tunneling with a gate voltage source'20138,313,236'Thermal conductivity detector'20128,099,995'Choked flow isolator for noise reduction in analytical systems'20127,867,782'Nanoscale moiety placement methods'20117,563,486'Systems and methods for designing and fabricating multi-layer structures having thermal expansion properties'20097,553,730'Methods of fabrication employing nanoscale mandrels'20097,347,921'Apparatus and method for threading a biopolymer through a nanopore'20087,275,562'Extensible spiral for flex circuit'20077,250,115'Nanopore with resonant tunneling electrodes'20077,138,672'Apparatus and method for making a tensile diaphragm with an insert'20067,095,933'Systems and methods for designing and fabricating multi-layer structures having thermal expansion properties'20067,075,161'Apparatus and method for making a low capacitance artificial nanopore'20067,026,124'Method and multiple reservoir apparatus for fabrication of biomolecular arrays'20067,004,556'High print quality inkjet printhead'20066,846,702'Nanopore chip with N-type semiconductor'20056,843,281'Methods and apparatus for introducing liquids into microfluidic chambers'20056,799,822'High quality fluid ejection device'20046,789,965'Dot printer with off-axis loading'20046,682,702'Apparatus and method for simultaneously conducting multiple chemical reactions'20046,662,435'Method of manufacturing an ink jet print head'20036,538,207'Strain relief structures for lead connections'20036,491,377'High print quality printhead'20026,461,812'Method and multiple reservoir apparatus for fabrication of biomolecular arrays'20026,398,850'Gas extraction device for extracting gas from a microfluidics system'20026,386,219'Fluid handling system and method of manufacture'20026,360,775'Capillary fluid switch with asymmetric bubble chamber'20026,331,678'Reduction of blistering and delamination of high-temperature devices with metal film'20016,299,673'Gas extraction device for extracting gas from a microfluidics system'20016,238,805'Low-stress interface between materials having different coefficients of expansion and method for fabricating same'20016,231,168'Ink jet print head with flow control manifold shape'20016,212,956'High output capacitative gas/liquid detector'20016,176,573'Gas-flow management using capillary capture and thermal release'20016,132,033'Inkjet print head with flow control manifold and columnar structures'20006,062,681'Bubble valve and bubble valve-based pressure regulator'20005,969,736'Passive pressure regulator for setting the pressure of a liquid to a predetermined pressure differential below a reference pressure'19995,954,079'Asymmetrical thermal actuation in a microactuator'19995,804,314'Silicon microstructures and process for their fabrication'19985,780,748'Flow device having parallel flow surfaces which move toward and away from one another to adjust the flow channel in proportion to applied force'19985,709,773'Silicon microstructures and process for their fabrication'19985,699,462'Total internal reflection optical switches employing thermal activation'19975,581,028'Fluid property sensors incorporating plated metal rings for improved packaging'19965,333,831'High performance micromachined valve orifice and seat'19945,062,302'Laminated semiconductor sensor with overpressure protection'19915,060,526'Laminated semiconductor sensor with vibrating element'19915,058,856'Thermally-actuated microminiature valve'19914,904,978'Mechanical sensor for high temperature environments'19904,882,933'Accelerometer with integral bidirectional shock protection and controllable viscous damping'19894,665,610'Method of making a semiconductor transducer having multiple level diaphragm structure'19874,587,719'Method of fabrication of long arrays using a short substrate'19864,537,680'Integral fluid filter and capillary'19854,516,148'Semiconductor device having improved lead attachment'19854,425,544'Dual-gate deep-depletion technique for carrier-generation-lifetime measurement'1984

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1984–1991Based in Palo Alto, CA, US· patent location history
1985–1986Patents assigned to UNIV LELAND STANFORD JUNIOR (3)· patent assignee history
1991–2002Patents assigned to HEWLETT PACKARD CO (15)· patent assignee history
1994–2020Based in Portola Valley, CA, US· patent location history
2001–2014Patents assigned to AGILENT TECHNOLOGIES INC (23)· patent assignee history
2003–2004Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (2)· patent assignee history
2006–2013Patents assigned to BARTH PHILLIP W (4)· patent assignee history
2007Based in Portola, CA, US· patent location history
2014Based in Loveland, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
AGILENT TECHNOLOGIES INC232001–2014
HEWLETT PACKARD CO151991–2002
BARTH PHILLIP Wself42006–2013
UNIV LELAND STANFORD JUNIOR31985–1986
HEWLETT PACKARD DEVELOPMENT CO22003–2004
Locations
LocationPatentsSpan
Portola Valley, California, US421994–2020
Palo Alto, California, US101984–1991
Loveland, California, US12014
Portola, California, US12007