Inventor

Yuzhe Hong

Inventor
US

Overview

1→
Patents
2024
Patent span
Performing operations
Primary field (CPC B)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering20%
B28BShaping clay or other ceramic compositions20%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering20%
C03BManufacture, shaping, or supplementary processes20%
Y02PClimate change mitigation technologies in the production or processing of goods20%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2024Patents assigned to UNIV CLEMSON RES FOUNDATION (1)· patent assignee history
2024Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
UNIV CLEMSON RES FOUNDATION12024
Locations
LocationPatentsSpan
US12024