Inventor
Masao Inoue
Inventor
Tokyo, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices15%
H10BElectronic memory devices15%
H10DInorganic electric semiconductor devices15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
B21DWorking or processing of sheet metal or metal tubes, rods or profiles without essentially removing material10%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form10%
B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers10%
Y10TTechnical subjects covered by former us classification10%
PatentTitleYear
11,133,422Method for manufacturing a semiconductor device202111,094,833Semiconductor device including memory using hafnium and a method of manufacturing the same202111,081,596Semiconductor device and manufacturing device of the same20215,820,954'Steel strip for three-piece can body, production process thereof and resistance seam welded three-piece can body'19985,597,436'Process for producing a print laminated steel strip used for the manufacture of a three-piece can body'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–1998Patents assigned to DAIWA CAN CO LTD (2)· patent assignee history
1997–1998Patents assigned to NIPPON STEEL CORP (2)· patent assignee history
1997–1998Based in Kitakyusyu, JP· patent location history
2021Patents assigned to RENESAS ELECTRONICS CORP (3)· patent assignee history
2021Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| RENESAS ELECTRONICS CORP | 3 | 2021 |
| DAIWA CAN CO LTD | 2 | 1997–1998 |
| NIPPON STEEL CORP | 2 | 1997–1998 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 3 | 2021 |
| Kitakyusyu, JP | 2 | 1997–1998 |