Inventor
Georgios DOGIAMIS
Inventor
US
Overview
Patents· 65 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H01LSemiconductor devices23%
H01PWaveguides17%
H05KPrinted circuits6%
H03HImpedance networks, e.g. resonant circuits4%
H01QAntennas, i.e. radio aerials3%
G02BOptical elements, systems or apparatus3%
H04BTransmission3%
H01RElectrically-conductive connections2%
H04LTransmission of digital information, e.g. telegraphic communication2%
PatentTitleYear
12,500,207Packaging architecture with intermediate routing layers202512,469,630Inductor and transformer semiconductor devices using hybrid bonding technology202512,469,954High precision scalable packaging architecture based on radio frequency scanning202512,463,156Packaging architectures for sub-terahertz radio frequency devices202512,424,563Disaggregated entropy services for microelectronic assemblies202512,406,962Power delivery through capacitor-dies in a multi-layered microelectronic assembly202512,341,114Microelectronic assemblies having a hybrid bonded interposer for die-to-die fan-out scaling202512,327,795Waveguide interconnect bridges202512,300,579Liquid cooled interposer for integrated circuit stack202512,266,840Waveguide interconnects for semiconductor packages and related methods202512,261,097Thermal management in integrated circuit packages202512,255,158Components for millimeter-wave communication202512,199,012Modular microchannel thermal solutions for integrated circuit devices202512,170,244High-throughput additively manufactured power delivery vias and traces202412,166,261Components for millimeter-wave communication202412,155,372Multi-filter die202412,150,271Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device202412,126,067Millimeter-wave dielectric waveguide including an opening of varying cross-section enclosed within a first material and the first material surrounded by a second material202412,126,068Millimeter-wave dielectric waveguide bundle including first and second adjacent dielectric waveguides having different core and/or cladding materials202412,107,314Microelectronic support for millimeter-wave communication including a transmission line trace and via pad spaced apart from a respective anti-trace and anti-pad202412,088,360Dispersive waveguide crosstalk mitigation202412,087,682Power delivery structures202412,040,776Integrated radio frequency (RF) front-end module (FEM)202412,040,307Magnetic induced heating for solder interconnects202412,021,289Components for millimeter-wave communication202412,007,170Thermal management in integrated circuit packages202411,990,419Physically unclonable function circuitry of a package substrate and method of providing same202411,984,439Microelectronic assemblies202411,955,684Components for millimeter-wave communication202411,916,604Dispersion compensation for electromagnetic waveguides202411,895,815Additive manufacturing for integrated circuit assembly cables202411,887,944Additive manufacturing for integrated circuit assembly connectors202411,842,826Additive manufacturing for integrated circuit assembly connector support structures202311,830,831Semiconductor package including a modular side radiating waveguide launcher202311,830,787Thermal management in integrated circuit packages202311,784,108Thermal management in integrated circuit packages202311,764,452Integrated circuit including a dielectric waveguide with a cavity therein surrounded by a conductive coating forming a wall for the cavity202311,728,290Waveguide fan-out202311,721,650Method for fabricating multiplexed hollow waveguides of variable type on a semiconductor package202311,715,693Dielectric waveguide channel for interconnecting dies in a semiconductor package usable in a computing device and method of manufacture202311,716,826Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device202311,694,962Microelectronic package with mold-integrated components202311,688,660Bridge for radio frequency (RF) multi-chip modules202311,652,264Microelectronic assemblies with substrate integrated waveguide202311,641,711Microelectronic package with substrate-integrated components202311,621,192Inorganic dies with organic interconnect layers and related structures202311,605,603Microelectronic package with radio frequency (RF) chiplet202311,594,801Mmwave dielectric waveguide interconnect topology for automotive applications202311,581,272Contactless high-frequency interconnect202311,538,758Waveguide interconnect bridges202211,532,574Through-substrate waveguide202211,476,554Mmwave waveguide to waveguide connectors for automotive applications202211,462,810Multiplexer and combiner structures embedded in a mmwave connector interface202211,437,706Package with side-radiating wave launcher and waveguide202211,394,094Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements202211,367,937Waveguides with active or passive repeaters for range extension202211,329,359Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities202211,328,986Capacitor-wirebond pad structures for integrated circuit packages202211,316,497Multi-filter die202211,309,619Waveguide coupling systems and methods202211,310,907Microelectronic package with substrate-integrated components202211,264,687Microelectronic assemblies comprising a package substrate portion integrated with a substrate integrated waveguide filter202211,251,512Pluggable MM-wave module for rack scale architecture (RSA) servers and high performance computers (HPCS)202211,165,129Dispersion reduced dielectric waveguide comprising dielectric materials having respective dispersion responses202111,158,917Dual-substrate waveguide filter2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to INTEL CORP (65)· patent assignee history
2021–2025Based in US· patent location history
2022Patents assigned to INTEL COROPRATION (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 65 | 2021–2025 |
| INTEL COROPRATION | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 65 | 2021–2025 |