Inventor
Yoshihiro Ihara
Inventor
Nagano, JP
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H01RElectrically-conductive connections17%
H01LSemiconductor devices6%
A61BDiagnosis4%
C25DProcesses for the electrolytic or electrophoretic production of coatings4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
Y10TTechnical subjects covered by former us classification4%
A61MDevices for introducing media into, or onto, the body2%
A61NElectrotherapy2%
PatentTitleYear
10,588,533Bioelectrode component202010,319,963Battery and method for producing the same201910,257,934Circuit board module201910,219,745Sensor including a peelable insulation sheet20199,716,053'Semiconductor device, heat conductor, and method for manufacturing semiconductor device'20179,508,670'Semiconductor device including semiconductor chips stacked via relay substrate'20169,245,856'Semiconductor device'20168,827,730'Socket and semiconductor device provided with socket'20148,784,118'Connection terminal structure, method for manufacturing connection terminal structure, and connection terminal structure substrate'20148,735,737'Substrate having leads'20148,419,442'Socket and method of fabricating the same'20138,294,253'Semiconductor device, electronic device and method of manufacturing semiconductor device, having electronic component, sealing resin and multilayer wiring structure'20128,179,692'Board having connection terminal'20128,152,535'Socket having two relay boards and a frame for holding a terminal to connect an electronic device to a mounting board'20128,083,529'Socket'20117,972,149'Board with connection terminals'20117,220,657'Semiconductor wafer and semiconductor device provided with columnar electrodes and methods of producing the wafer and device'20076,667,235'Semiconductor device and manufacturing method therefor'20036,413,404'Method of forming bumps by electroplating'20026,184,567'Film capacitor and semiconductor package or device carrying same'20016,030,512'Device for forming bumps by metal plating'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2020Patents assigned to SHINKO ELECTRIC IND CO (21)· patent assignee history
2000–2020Based in Nagano, JP· patent location history
2011–2014Patents assigned to IHARA YOSHIHIRO (8)· patent assignee history
2013Patents assigned to HORIKAWA YASUYOSHI (1)· patent assignee history
2013Patents assigned to MOCHIZUKI KENJI (1)· patent assignee history
2014Patents assigned to KITAJIMA MASAKUNI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINKO ELECTRIC IND CO | 21 | 2000–2020 |
| IHARA YOSHIHIROself | 8 | 2011–2014 |
| HORIKAWA YASUYOSHI | 1 | 2013 |
| KITAJIMA MASAKUNI | 1 | 2014 |
| MOCHIZUKI KENJI | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nagano, JP | 21 | 2000–2020 |